Lead Semiconductor Packaging Engineer (Quantum Computing)

Location: On-site at a supplier site in Malta, NY, United States

Salary: $152,000–$190,000 annually, including the bonus target.

Company

hirify.global develops quantum computing hardware and highly scaled ion trap systems.

What you will do

• Develop advanced packaging concepts for tiling ion trap, electrical, and optical chips into large assemblies.
• Lead cross-functional teams in defining packaging strategies for large-format ion trap chips with high I/O density.
• Generate mechanical, thermal, electrical, and optical packaging requirements.
• Lead packaging engineers and work with vendors to implement and validate packaging processes.
• Support ion trap development and ensure packaging compatibility with system requirements.
• Build supplier, third-party, and co-development partnerships.

Requirements

• Bachelor’s degree with 10+ years of relevant experience, Master’s degree with 8+ years, or PhD with 6+ years in advanced semiconductor packaging development.
• Must be a U.S. Person: a U.S. citizen, permanent resident or green card holder, or worker granted asylum or refugee status.
• Due to national security requirements, candidates must not be nationals of the People’s Republic of China or Russia unless also a U.S. citizen.
• Experience with advanced large-area multi-chip packaging, heterogeneous integration, and 2.5D–3D packaging techniques.
• Experience with high-density I/O, photonic packaging, and fiber-to-chip or optical chip-to-optical chip coupling.
• Applicants for safety-sensitive positions must complete a pre-employment drug test.

Nice to have

• PhD in Physics or Engineering.
• Track record of innovation and intellectual property development.
• Experience working in cross-functional engineering teams.

Culture & Benefits

• Full-time employment with hirify.global.
• Incentive eligibility with the posted range inclusive of the bonus target.
• Work with vendors and third parties on advanced quantum computing hardware development.