JEDI NCG 3D Heterogeneous Integration Engineer

Location: Leuven, Flemish Brabant, Belgium; 3-year local contract assignment at IMEC in Leuven, with a path to Malta, NY, USA.

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services to technology companies worldwide.

What you will do

• Support research and development in 3D packaging and system co-optimization within IMEC industrial affiliation programs.
• Learn and transfer direct die-to-wafer bonding, wafer-to-wafer hybrid bonding, and other 3D heterogeneous integration processes to hirify.global R&D.
• Lead bilateral joint-development projects between hirify.global and IMEC, including hands-on experiments, integration, and system analysis.
• Build relationships with semiconductor materials and tooling vendors and support technology-transfer activities.
• Contribute to invention disclosures, scientific publications, conferences, technical updates, and executive readouts.
• Scout new materials, integration schemes, simulation models, and design platforms for transfer to hirify.global.

Requirements

• Technology-related degree, preferably a PhD, in physics, electrical engineering, chemistry, computer engineering, materials science, chemical engineering, or a related engineering or physical sciences discipline.
• Fluent use of Microsoft Office applications, including Excel, Word, PowerPoint, Outlook, and Teams.
• Ability to work effectively with diverse teams, customers, and internal and external partners.
• Fluent written and verbal English required.
• Strong interpersonal, problem-solving, self-management, and conflict-resolution skills.
• Ability to provide clear guidance on critical technical decisions.

Nice to have

• Systems partitioning expertise for product form-factor and performance optimization.
• Experience defining interconnect strategies, including heterogeneous integration, electrical die-to-die connectivity, and broadband surface coupling.
• Experience selecting technology-development partners such as corporations, universities, or research institutes.
• Experience designing electrical test structures for interconnects and packages.
• Project management skills and the ability to execute solutions in ambiguous environments.

Culture & Benefits

• Work with hirify.global R&D teams, IMEC researchers, vendors, customers, and external partners.
• Participate in joint-development projects, technical update sessions, partner technical weeks, publications, and conferences.
• Benefits are provided through hirify.global Europe programs.