Senior Heterogenous Integration Process Engineer

Location: Albany, NY, United States; onsite office-based role

Salary: $123,806.02–$174,945.55 per year

Company

hirify.global’s TEL Technology Center, America is an advanced R&D center developing semiconductor process technologies and equipment solutions in collaboration with customers, research institutions, and global R&D teams.

What you will do

• Lead R&D programs in heterogeneous and 3D device integration, including C2W, D2W, wafer bonding, fusion bonding, hybrid bonding, wafer thinning, and TSV technologies.
• Define technical strategy and align research activities with business objectives and semiconductor technology roadmaps.
• Conduct fundamental research and develop innovative semiconductor processes and hardware solutions.
• Evaluate technology feasibility through modeling, simulation, and experimentation, and drive technology pathfinding.
• Collaborate with global teams, customers, and joint development partners on technical programs.
• Provide technical leadership, mentor researchers, and communicate results and recommendations to stakeholders.

Requirements

• Ph.D. in materials science, mechanical, chemical, or electrical engineering, physics, chemistry, nanotechnology, or a related field.
• At least 5 years of semiconductor R&D experience.
• Strong expertise in advanced packaging, heterogeneous integration, and/or 3D device integration.
• Hands-on experience with wafer bonding, process integration, or related semiconductor technologies.
• Strong problem-solving, analytical, experimental, project management, organizational, and communication skills.
• Demonstrated technical leadership through cross-functional programs, publications, patents, or industry contributions.

Nice to have

• Experience with bonded-CFET, VCT DRAM, or 3D-stacked memory and logic devices.
• Knowledge of semiconductor industry trends and technology roadmaps.

Culture & Benefits

• Medical, vision, and dental insurance.
• Paid personal leave and holiday time.
• 401(k) retirement plan with employer matching.
• Tuition reimbursement and healthy lifestyle incentives.
• Employee assistance programs.
• Travel of up to 20% may be required.