Senior Advanced Packaging Engineer (AI)

Location: Remote, Taiwan (HSQ)

Company

hirify.global is a Silicon Valley-based hardware startup developing infrastructure solutions that accelerate AI data centers through innovations in silicon, packaging, software, and systems.

What you will do

• Plan and execute test vehicles for advanced packaging process development, material evaluation, design validation, and manufacturing readiness.
• Coordinate package development, engineering builds, qualification milestones, tooling, materials, process maturity, and yield performance with foundries, substrate suppliers, OSATs, and system assembly partners.
• Serve as the primary local technical interface with external engineering and manufacturing partners in Taiwan.
• Lead resolution of package integration, manufacturing, quality, yield, material, and build issues through root cause analysis and corrective actions.
• Ensure packaging solutions satisfy DFM, thermal, mechanical, electrical, reliability, and system-level requirements.
• Report technical status, risks, recommendations, qualification results, and manufacturing readiness to US-based engineering leadership and global stakeholders.

Requirements

• Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, or a related engineering discipline.
• 8+ years of hands-on experience in advanced semiconductor packaging, including multi-die integration, CoWoS, silicon interposers, silicon bridges, or comparable chiplet packaging technologies.
• Experience planning, developing, and qualifying engineering test vehicles for package technology development, process optimization, and product enablement.
• Strong knowledge of advanced substrates, silicon interposers, die-to-die interconnects, fine-pitch assembly, multi-chip packages, and package or board-level reliability testing.
• Working knowledge of DFM, DOE, FMEA, root cause analysis, failure analysis, and process qualification methodologies.
• Fluent Mandarin and English with excellent written and verbal communication skills; ability to build relationships with packaging and system assembly partners in Taiwan.

Nice to have

• Master’s degree in a relevant engineering or materials discipline.

Culture & Benefits

• Work independently in a fast-paced product development environment.
• Collaborate with global cross-functional engineering teams and international supply-chain partners.
• Join a world-class engineering organization working on AI data-center infrastructure and next-generation semiconductor packaging.