Electromechanical Packaging Engineer (AI)

Location: Hybrid in Torrance, California, with at least 3 days per week in the office

Salary: $150,000–$200,000 per year

Company

Develops power management hardware and software to reduce energy consumption and improve the efficiency of AI computing.

What you will do

• Support chip-scale packaging design and HDI organic substrate layout for integrated voltage regulator products.
• Create mechanical drawings for substrate fabrication and packaged-part assembly.
• Collaborate with substrate layout, ASIC design, and manufacturing engineers.
• Coordinate with vendors for components, assembly, and testing.

Requirements

• Bachelor’s degree or higher in Mechanical or Electrical Engineering; a master’s degree is preferred.
• 5+ years of experience in microelectronics packaging and/or PCB design.
• Knowledge of foundry and chip-scale assembly processes.
• Proficiency with 3D mechanical CAD software such as Creo, NX, or CATIA, including mechanical drawings and GD&T.
• Ability to read and create electrical schematics, with an understanding of how electrical requirements affect substrate layout and interconnect selection.
• Basic understanding of wafer and substrate tape-out processes and design for manufacturability.

Nice to have

• Familiarity with PCB design tools such as Altium, Cadence, or Mentor.
• Basic understanding of component-level thermal analysis.

Culture & Benefits

• Career growth opportunities with potential for rapid advancement.
• Employer-paid medical, dental, and vision coverage for employees and families.
• 14 weeks of paid maternity and paternity leave at normal pay.
• Unlimited PTO with management approval.
• Professional development and continued learning opportunities.
• Optional 401(k), FSA, and equity incentives.