Назад
Company hidden
3 часа назад

Member of Technical Staff (Power Integrity/Signal Integrity)

180 000 - 250 000$
Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
Для мэтча и отклика нужен Plus

Мэтч & Сопровод

Для мэтча с этой вакансией нужен Plus

Описание вакансии

Текст:
/
TL;DR
Member of Technical Staff (Power Integrity/Signal Integrity): Enabling customer GPU/CPU SoC power solutions using PowerLattice’s chiplet-based power delivery network with an accent on package-level PI/SI, electrical modeling, and advanced 2.5D/3D packaging. Focus on optimizing PDN designs, validating package models, debugging simulation and electrical testing workflows, and guiding customers from early modeling through system bring-up.

Location: Hybrid, requiring 3 days a week onsite at either Chandler, AZ, or Vancouver, WA. Chandler is preferred; exceptional candidates based in Silicon Valley, CA may be considered for remote flexibility.

Salary: $180,000–$250,000 annual base salary, plus stock options.

Company

hirify.global is a well-funded semiconductor startup developing chiplet-based power delivery solutions for AI and advanced-computing SoCs.

What you will do

  • Enable customers to design GPU and CPU SoC power solutions using hirify.global’s chiplet.
  • Support customer PDN design optimization with the company’s design kit.
  • Guide customers through adoption from early modeling and physical design to system bring-up.
  • Gather customer feedback and translate it into customer-enablement and product-development improvements.
  • Serve as the primary technical point of contact for tier-one customer engineering teams.
  • Handle sensitive technical information with strict confidentiality.

Requirements

  • 8+ years of experience in power integrity and/or signal integrity for high-performance SoCs.
  • Expertise with PI/SI toolchains, simulation flows, and analysis workflows.
  • Hands-on experience extracting, building, and validating SoC package electrical models.
  • Strong package-level PI/SI experience covering substrates, interposers, and advanced 2.5D/3D packaging.
  • Strong debugging skills across simulation and electrical testing environments.
  • Excellent communication, professionalism, discretion, technical judgment, and ability to work independently.

Nice to have

  • Experience at a major processor or ASIC company.
  • Experience as an engineering or project lead in a related technical area.
  • Hands-on experience with PI/SI electrical test methodologies and instrumentation.
  • Experience with advanced package technologies such as CoWoS and 2.5D packaging.

Culture & Benefits

  • Fast-paced, well-funded startup environment with significant ownership and growth opportunities.
  • Health, dental, and vision benefits.
  • 401(k) plan.
  • Stock option grant.

Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →