Substrate Supplier Enablement Engineer (Semiconductor)

TL;DR

Substrate Supplier Enablement Engineer (Semiconductor): Leading substrate supplier development and qualification for advanced packaging technologies with an accent on technical enablement and readiness milestones. Focus on driving yield improvement, managing critical process interactions, and ensuring successful production ramps for high-density FCBGA and glass core substrates.

Location: Hybrid (Seoul, South Korea)

Company

Global leader in semiconductor design and manufacturing.

What you will do

• Lead substrate supplier development and qualification for advanced technologies including high-density FCBGA, EMIB-T, and glass core substrates.
• Collaborate with suppliers and internal teams to develop robust processes for lithography, electrolytic multi-metal plating, and dielectric lamination.
• Design and implement factory technology validation and product certification plans to drive yield improvement.
• Develop and maintain detailed micro-schedules and milestones for new factory startup activities.
• Monitor ramp indicators to ensure incident-free production and successful introduction of new capacity.
• Manage critical process interactions by partnering with on-site supplier engineering teams.

Requirements

• Bachelor's degree with 6+ years of experience, Master's with 4+ years, or PhD with 2+ years in Mechanical, Materials, Chemical, or Electrical Engineering, or Physics.
• Proficiency in statistical tools and methods, specifically Statistical Process Control (SPC).
• Experience managing complex projects and delivering results in high-volume manufacturing environments.
• Must be based in or able to work from Seoul, South Korea.
• Ability to participate in periodic evening meetings with East Asia suppliers and perform occasional travel to supplier sites.

Nice to have

• Strong foundation in advanced packaging, substrates, or semiconductor manufacturing.
• Proven leadership in supplier management or technology enablement across global teams.
• Experience with process flow development, FMEA, DOE design, and problem-solving tools.
• Ability to deliver results under pressure in high-ambiguity environments.

Culture & Benefits

• Hybrid work model allowing employees to split time between on-site and off-site work.
• Opportunity to work on cutting-edge substrate packaging and wafer assembly solutions.
• Commitment to ethical hiring practices and RBA compliance.