Senior Director, Design Manufacturing Solutions (DMS) Business Unit

Location: Austin RiverSouth, with flexible, hybrid, or onsite work arrangements

Company

hirify.global America, Inc. operates the TEL US organization.

What you will do

• Lead the strategic, technical, operational, and financial performance of the Design Manufacturing Solutions business unit.
• Oversee end-to-end ASIC and SoC development from architecture and RTL design through verification, physical design, DFT, tape-out, silicon validation, and production release.
• Define business strategy, roadmaps, investment plans, operational metrics, workforce plans, and succession planning.
• Manage customer relationships, executive sponsorship, proposals, solution architecture, contract negotiations, and program execution.
• Drive program governance, P&L, budgets, staffing, risk management, quality, productivity, and cost optimization.
• Build and develop global engineering and management teams while representing the organization with foundries, EDA vendors, IP providers, customers, and industry partners.

Requirements

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Business, Marketing, or a related field.
• At least 20 years of semiconductor industry experience with significant ASIC or SoC development expertise.
• At least 8 years of leadership experience managing large engineering organizations and senior technical leaders.
• Proven delivery of multiple ASIC or SoC programs from concept through production.
• Deep understanding of ASIC development flows and experience with strategic customer engagements.
• Demonstrated ability to transform and scale engineering organizations, launch a new business model, and lead executive-level discussions.

Nice to have

• Master’s degree or Ph.D. in Electrical Engineering, Computer Engineering, Business, Marketing, or a related discipline.
• Experience with advanced process nodes, including 5nm and 3nm, or foundry-interfacing roles.
• Experience with AI/ML accelerators, networking, automotive, wireless, HPC, or data-center semiconductor solutions.
• Global leadership experience with geographically distributed teams, especially in the Asia-Pacific region.
• Experience with semiconductor outsourcing, design services, ASIC business models, commercial contracts, SOWs, and customer program governance.

Culture & Benefits

• Work in a flexible, hybrid, or onsite arrangement.
• Collaborate with global teams and external semiconductor ecosystem partners.
• Support innovation, accountability, collaboration, technical excellence, and professional growth.
• Work in an office environment with reasonable accommodations available for qualified individuals with disabilities.