11 часов назад
Technical Chief of Staff for ASIC Engineering (Semiconductor)
216 000 - 300 000$
Мэтч & Сопровод
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Описание вакансии
Текст:
TL;DR
Technical Chief of Staff for ASIC Engineering (Semiconductor): Driving engineering leadership cadence and managing complex ASIC tapeout programs with an accent on silicon execution, cross-functional alignment, and organizational scaling. Focus on tracking milestones, IP deliveries, requirements, resources, quality KPIs, and risks while resolving high-leverage technical and operational decisions through influence.
Location: Fully in person in San Jose, California, United States
Salary: $216,000–$300,000 per year, depending on experience, level, and business need; discretionary bonus, incentives, and benefits may be available.
Company
provides rack-scale AI infrastructure through semiconductor-based connectivity solutions and software for hyperscalers and ecosystem partners.
What you will do
- Drive the operational cadence for ASIC Engineering, including all-hands meetings, staff meetings, leadership syncs, technical talks, university engagements, and action follow-through.
- Frame and resolve high-leverage technical, operational, and organizational decisions while surfacing blockers and managing escalations.
- Partner with Hardware, Product, and Quality teams to align priorities, communications, and execution.
- Lead status and milestone management for ASIC tapeout programs, including methodology checklists and boundary agreements.
- Track IP deliveries, version inventory, vendor issues, requirements, resources, quality KPIs, and engineering documentation.
- Produce internal status reporting for Silicon Engineering leadership and drive outcomes through influence rather than hierarchy.
Requirements
- 10+ years of experience in semiconductor, SoC, ASIC, or a similarly complex engineering environment.
- Proven success as a Chief of Staff, Staff Program Manager, TPM Director, or in a similar technical leadership-enablement role.
- Strong technical acumen, including the ability to assess engineering trade-offs, make decisions with limited information, challenge assumptions, and build credibility with senior individual contributors.
- Experience running program cadence for complex silicon programs, including tapeout and IP integration.
- Ability to organize complex workflows, drive consistent follow-through, navigate organizational tension, and align diverse viewpoints.
- Exceptional written and verbal communication, structured thinking, execution discipline, and organizational awareness.
Nice to have
- Prior experience leading RTL2GDSII chip design.
Culture & Benefits
- Fully in-person collaboration at the San Jose location.
- Potential eligibility for discretionary bonus, incentives, and benefits.
- Inclusive workplace that encourages applications from people with diverse backgrounds and experiences.
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