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11 часов назад

Technical Chief of Staff for ASIC Engineering (Semiconductor)

216 000 - 300 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Technical Chief of Staff for ASIC Engineering (Semiconductor): Driving engineering leadership cadence and managing complex ASIC tapeout programs with an accent on silicon execution, cross-functional alignment, and organizational scaling. Focus on tracking milestones, IP deliveries, requirements, resources, quality KPIs, and risks while resolving high-leverage technical and operational decisions through influence.

Location: Fully in person in San Jose, California, United States

Salary: $216,000–$300,000 per year, depending on experience, level, and business need; discretionary bonus, incentives, and benefits may be available.

Company

hirify.global provides rack-scale AI infrastructure through semiconductor-based connectivity solutions and software for hyperscalers and ecosystem partners.

What you will do

  • Drive the operational cadence for ASIC Engineering, including all-hands meetings, staff meetings, leadership syncs, technical talks, university engagements, and action follow-through.
  • Frame and resolve high-leverage technical, operational, and organizational decisions while surfacing blockers and managing escalations.
  • Partner with Hardware, Product, and Quality teams to align priorities, communications, and execution.
  • Lead status and milestone management for ASIC tapeout programs, including methodology checklists and boundary agreements.
  • Track IP deliveries, version inventory, vendor issues, requirements, resources, quality KPIs, and engineering documentation.
  • Produce internal status reporting for Silicon Engineering leadership and drive outcomes through influence rather than hierarchy.

Requirements

  • 10+ years of experience in semiconductor, SoC, ASIC, or a similarly complex engineering environment.
  • Proven success as a Chief of Staff, Staff Program Manager, TPM Director, or in a similar technical leadership-enablement role.
  • Strong technical acumen, including the ability to assess engineering trade-offs, make decisions with limited information, challenge assumptions, and build credibility with senior individual contributors.
  • Experience running program cadence for complex silicon programs, including tapeout and IP integration.
  • Ability to organize complex workflows, drive consistent follow-through, navigate organizational tension, and align diverse viewpoints.
  • Exceptional written and verbal communication, structured thinking, execution discipline, and organizational awareness.

Nice to have

  • Prior experience leading RTL2GDSII chip design.

Culture & Benefits

  • Fully in-person collaboration at the San Jose location.
  • Potential eligibility for discretionary bonus, incentives, and benefits.
  • Inclusive workplace that encourages applications from people with diverse backgrounds and experiences.

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