3D Heterogeneous Integration Design Enablement Engineer (2026 New College Graduate)

Location: Malta, New York, USA

Salary: $65,400–$145,800 per year

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services with manufacturing operations across three continents.

What you will do

• Develop 3D heterogeneous integration design enablement for advanced packaging R&D, including wafer-to-wafer bonding, die-to-wafer bonding, TSV/TOV, and interposer development.
• Publish Design Manual specifications based on packaging failure modes and product-line requirements.
• Translate advanced packaging requirements into device enablement specifications covering design rules, TSV layouts, LVS requirements, and device model terminals.
• Draft test vehicle content and test specifications, and support tapeout and mask review activities.
• Coordinate with inline and laboratory test teams, vendors, OSATs, product lines, fab teams, and customers.
• Support environmental, health, safety, and security requirements and other assigned engineering activities.

Requirements

• PhD with a completed defended thesis or a master’s degree in Electrical Engineering, Materials Science, or a related field.
• Minimum overall GPA of 3.0 and good academic standing.
• Fluent written and verbal English required.
• Availability to travel up to 10%.
• Ability to work onsite in Malta, New York.

Nice to have

• Internship or co-op experience in design or EDA/design enablement.
• Knowledge of semiconductor packaging process modules and integration.
• Leadership experience in workplace, academic projects, or competitions.
• Project management, planning, organizational, written, and verbal communication skills.

Culture & Benefits

• Full-time employment at a semiconductor manufacturing and R&D organization.
• Work in a state-of-the-art 300mm fabrication facility.
• Equal opportunity workplace with a focus on cultural diversity.