Product Engineering Lead (Optical Interconnect)

Location: Egypt

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services with manufacturing operations across three continents.

What you will do

• Own end-to-end New Product Introduction execution for optical interconnect solutions from prototype builds through manufacturing release, qualification, and volume ramp.
• Drive manufacturing readiness for Co-Packaged Optics and pluggable optics, including process flows, assembly, testing, tooling, documentation, and supplier readiness.
• Develop production test strategies, characterization plans, qualification plans, and release criteria for high-speed optical products supporting 100G, 200G, and 400G per lane architectures.
• Lead cross-functional readiness reviews across design, packaging, assembly, test, reliability, quality, operations, and supply chain.
• Track NPI milestones, build plans, yield targets, ramp metrics, production release gates, and factory readiness dashboards.
• Lead yield optimization, root-cause analysis, corrective actions, and production ramp decisions across internal and external manufacturing partners.

Requirements

• Bachelor’s degree in Electrical Engineering, Photonics, Optical Engineering, or a related technical discipline; an advanced degree is preferred.
• 10+ years of experience in product engineering, NPI, manufacturing, test, quality, or production ramp for semiconductor, photonics, optical module, or high-speed interconnect products.
• Demonstrated ownership of NPI programs from prototype builds through qualification, manufacturing release, and volume production ramp.
• Strong knowledge of optical transceivers, silicon photonics, photonic integrated circuits, lasers, modulators, detectors, optical engines, coupling, packaging, and module assembly.
• Experience with high-speed optical and electrical testing, qualification and reliability plans, yield analysis, failure-mode investigation, and corrective-action execution.
• Experience working with OSATs, contract manufacturers, component suppliers, foundries, or global manufacturing sites, plus strong cross-functional leadership and communication skills.

Culture & Benefits

• Base salary.
• Equity participation.
• Annual bonus plan.
• Medical insurance.
• Work in a matrixed global semiconductor manufacturing organization.