Team Lead Co-Packaged Optics (CPO)

Location: Stuttgart, Austin, or Munich

Company

hirify.global develops photonic processing systems that compute with light for scalable, energy-efficient AI and high-performance computing applications.

What you will do

• Build, mentor, and lead a high-performing co-packaged optics (CPO) packaging engineering team.
• Evaluate, qualify, and technically manage global OSAT partners, including onboarding at least two qualified CPO suppliers within 12 months.
• Drive development of photonic/electronic assemblies, including optical fiber coupling, advanced packaging materials, and thermal management.
• Implement design-for-manufacturability guidelines and reliability qualification against JEDEC and Telcordia standards.
• Coordinate chip design, systems, manufacturing, testing, and supply-chain stakeholders through new product introduction and volume production.
• Lead root-cause analysis using 8D, FMEA, and Ishikawa methods to resolve reliability and process deviations.

Requirements

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, or a related technical field.
• At least 5 years of experience in semiconductor packaging, back-end manufacturing, or an OSAT environment.
• Hands-on experience with co-packaged optics packaging, optical fiber attachment methods, substrates, underfills, and thermal interface materials.
• Experience evaluating global suppliers and building, scaling, and coaching engineering teams.
• Fluent English is required.
• Strong solution-oriented thinking, process ownership, and communication skills in high-growth technical environments.

Nice to have

• Experience with glass substrates.
• Proficiency in German.

Culture & Benefits

• Self-responsibility and accelerated professional development.
• Fast-paced environment with encouragement for experimentation.
• Opportunity to develop photonic computing technology and influence the future of computing.
• Collaboration within an international, highly skilled, cross-functional team.
• Direct access to the company founders.