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12 часов назад

Process Engineer (Photonics Manufacturing)

Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
b2
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Мэтч & Сопровод

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Описание вакансии

Текст:
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TL;DR
Process Engineer (Photonics Manufacturing): Developing and optimizing manufacturing processes for microelectronics packaging, optical module assembly, and high-precision automation lines with an accent on yield improvement, process qualification, and production ramp-up. Focus on SPC, DOE, FMEA, Cpk analysis, 8D root-cause investigations, and integrating new tooling and materials into high-volume manufacturing.

Location: On-site at the Bulim plant, Bulim Square

Company

hirify.global is a well-funded startup developing photonics infrastructure for AI supercomputing, including optical interconnects and scalable photonic engines.

What you will do

  • Establish process windows, parameter recipes, and standard operating procedures for die attach, wire bond, active alignment, or end-to-end line integration.
  • Monitor yield metrics, lead 8D root-cause investigations, and implement corrective actions for process and equipment defects.
  • Qualify new tooling, materials, and automation platforms for the transition from NPI to high-volume production.
  • Apply SPC, DOE, FMEA, and Cpk analysis to improve process stability, cycle time, and cost efficiency.
  • Collaborate with manufacturing operators, quality engineers, maintenance technicians, NPI, and equipment engineering teams to resolve line stops and maintain quality standards.

Requirements

  • Bachelor’s degree or diploma in mechanical, electrical/electronic, mechatronics, materials science, manufacturing engineering, or a related field.
  • 2+ years of process engineering experience in semiconductor packaging, microelectronics, SMT, or camera/optical module manufacturing.
  • Experience in at least one domain: die bond, wire bond, active alignment, or overall process integration.
  • For die bond: experience with epoxy/eutectic dispensing, precision pick-and-place, or flip-chip bonding.
  • For wire bond or active alignment: experience with wire bonders and bond testing, or multi-axis optical alignment, collimation, laser/lens positioning, and UV-cure dispensing.
  • Proficiency with SPC tools such as JMP or Minitab, GD&T, structured problem-solving methods, and on-site work at the Bulim plant during production ramp-up.

Culture & Benefits

  • Competitive salary and benefits.
  • Opportunities for career advancement.
  • Collaborative and innovative work environment.
  • Work with a multidisciplinary team addressing advanced photonics manufacturing challenges.

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