Staff Process Engineer, Packaging (Quantum Computing)

Location: Onsite in College Park, Maryland, United States; five days per week during training and initial ramp-up, with limited remote flexibility afterward. Minimal travel expected, under 10%.

Salary: $145,920–$209,241 USD base compensation, plus bonus, equity, and benefits.

Company

hirify.global develops integrated quantum computing, networking, sensing, and security solutions.

What you will do

• Provide sustaining engineering support in the cleanroom to keep QPU production, technician work, and equipment on track.
• Operate, program, troubleshoot, and improve packaging equipment, especially wire bonders and die or flip-chip bonding tools.
• Create, validate, release, and maintain equipment recipes and process programs using data-driven experimentation.
• Investigate equipment faults, process excursions, and product failures; identify root causes and implement verified corrective actions.
• Train and qualify operators and create clear work instructions, travelers, and operating guidance.
• Improve yield, throughput, repeatability, uptime, and process capability while supporting prototype and new-product builds.

Requirements

• Bachelor’s degree in engineering or physical sciences.
• 1–2 years of professional experience operating complex automated equipment in production, development, or laboratory environments.
• Experience diagnosing equipment or process problems, implementing fixes, and verifying results.
• Ability to learn unfamiliar equipment and processes quickly, work safely, and handle fragile hardware carefully.
• Clear communication skills and ability to train operators with varying technical experience.
• Ability to work onsite in College Park five days per week during training and initial ramp-up and work for extended periods in full cleanroom gowning.

Nice to have

• Hands-on experience with wire bonders, die bonders, optical packaging, or related precision hardware fields.
• Experience with solder reflow, epoxy dispense, plasma cleaning, optical inspection, profilometry or interferometry, electrical testing, or UHV-compatible assembly.
• Experience selecting, installing, qualifying, and releasing equipment and production recipes with vendors.
• Experience training operators and improving processes under schedule pressure.
• Background in microelectronics, optoelectronics, photonics, RF or microwave hardware, MEMS, aerospace electronics, or medical devices.

Culture & Benefits

• Hands-on, floor-first engineering culture focused on hardware delivery and team success.
• Benefits include medical, dental, and vision plans and matching 401(k).
• Unlimited PTO, paid holidays, parental and adoption leave, legal insurance, and a home technology stipend.
• Work culture emphasizes autonomy, productivity, respect, knowledge sharing, and careful execution.
• Employment is subject to U.S. export-control and government-contract requirements, including verification of U.S. Person status or confirmation of applicable authorization or license exception.