3 часа назад
Sr. Field Applications Engineer - Power Delivery
150 000 - 225 000$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Sr. Field Applications Engineer - Power Delivery (Chiplet-Based Power Delivery): Enabling tier-one customers to design and optimize GPU/CPU SoC power solutions using PowerLattice’s chiplet and design kit with an accent on package-level power integrity, signal integrity, and advanced packaging. Focus on debugging technical issues, guiding adoption from early modeling through system bring-up, and translating customer feedback into product improvements.
Location: Hybrid, with 3 days per week onsite at the Chandler, Arizona office or San Jose, California office
Salary: $150,000–$225,000 annual base salary
Company
is a well-funded semiconductor startup developing chiplet-based power delivery solutions for high-performance AI and advanced-computing chips.
What you will do
- Enable customers to design GPU and CPU SoC power solutions using ’s chiplet.
- Support power delivery network design optimization with the company’s design kit.
- Guide customers through the full adoption lifecycle, from early modeling to physical design and system bring-up.
- Serve as the primary technical point of contact for tier-one customer engineering teams.
- Gather customer feedback and translate it into customer-enablement and product-development improvements.
- Handle sensitive technical information with strict confidentiality.
Requirements
- 5+ years of experience in power integrity and/or signal integrity for high-performance SoCs.
- Experience with package-level power and signal integrity across motherboards, substrates, interposers, and advanced 2.5D/3D packaging.
- Strong debugging skills for reproducing and resolving technical issues.
- Excellent written and verbal communication skills for direct engagement with customer engineering teams.
- Professionalism, discretion, sound technical judgment, and the ability to work independently and proactively.
Nice to have
- Experience at a major processor or ASIC company in a related technical area.
- Experience as an engineering or project lead.
- Hands-on experience with electrical test methodologies and instrumentation for power or signal integrity.
- Experience with advanced package technologies such as CoWoS and 2.5D/3D packaging.
Culture & Benefits
- Fast-paced startup environment with significant ownership and technical impact.
- Stock option grant.
- Comprehensive health, dental, and vision benefits.
- 401(k) plan.
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