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3 часа назад

Sr. Field Applications Engineer - Power Delivery

150 000 - 225 000$
Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Sr. Field Applications Engineer - Power Delivery (Chiplet-Based Power Delivery): Enabling tier-one customers to design and optimize GPU/CPU SoC power solutions using PowerLattice’s chiplet and design kit with an accent on package-level power integrity, signal integrity, and advanced packaging. Focus on debugging technical issues, guiding adoption from early modeling through system bring-up, and translating customer feedback into product improvements.

Location: Hybrid, with 3 days per week onsite at the Chandler, Arizona office or San Jose, California office

Salary: $150,000–$225,000 annual base salary

Company

hirify.global is a well-funded semiconductor startup developing chiplet-based power delivery solutions for high-performance AI and advanced-computing chips.

What you will do

  • Enable customers to design GPU and CPU SoC power solutions using hirify.global’s chiplet.
  • Support power delivery network design optimization with the company’s design kit.
  • Guide customers through the full adoption lifecycle, from early modeling to physical design and system bring-up.
  • Serve as the primary technical point of contact for tier-one customer engineering teams.
  • Gather customer feedback and translate it into customer-enablement and product-development improvements.
  • Handle sensitive technical information with strict confidentiality.

Requirements

  • 5+ years of experience in power integrity and/or signal integrity for high-performance SoCs.
  • Experience with package-level power and signal integrity across motherboards, substrates, interposers, and advanced 2.5D/3D packaging.
  • Strong debugging skills for reproducing and resolving technical issues.
  • Excellent written and verbal communication skills for direct engagement with customer engineering teams.
  • Professionalism, discretion, sound technical judgment, and the ability to work independently and proactively.

Nice to have

  • Experience at a major processor or ASIC company in a related technical area.
  • Experience as an engineering or project lead.
  • Hands-on experience with electrical test methodologies and instrumentation for power or signal integrity.
  • Experience with advanced package technologies such as CoWoS and 2.5D/3D packaging.

Culture & Benefits

  • Fast-paced startup environment with significant ownership and technical impact.
  • Stock option grant.
  • Comprehensive health, dental, and vision benefits.
  • 401(k) plan.

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