Field Service Engineer (Semiconductor)

Location: Onsite at a semiconductor customer location in Phoenix, Arizona, United States; approximately 10% domestic travel required.

Company

hirify.global provides products and services for semiconductor manufacturing, including Microenvironments systems such as FOUPs, FOSBs, and reticle handling pods.

What you will do

• Provide onsite technical support for FOUP, FOSB, and reticle pod systems in customer fabs.
• Complete incoming inspections and identify defects affecting product performance and quality.
• Respond to quality alerts, field issues, and rework activities.
• Inspect, diagnose, and replace components to maintain product reliability.
• Prepare service reports and communicate findings and corrective actions to customer engineering and operations teams.
• Coordinate returns for rework or investigation and collaborate with cross-functional teams and external tool vendors on root cause analysis.

Requirements

• Associate’s or Bachelor’s degree in Mechanical Engineering, Engineering Technology, or a related field.
• Strong mechanical aptitude, troubleshooting ability, attention to detail, and defect identification skills.
• Strong communication skills and the ability to work directly with customers.
• Ability to interpret technical data and make quality decisions.
• Ability to work onsite in a semiconductor customer cleanroom environment and follow PPE and contamination-control protocols.
• Must not require hirify.global immigration sponsorship now or in the future, including H-1B, TN, or STEM OPT sponsorship.

Nice to have

• Manufacturing or production environment experience.
• Cleanroom experience.
• Familiarity with semiconductor processes or precision mechanical systems.

Culture & Benefits

• Collaborative, values-driven culture focused on People, Accountability, Creativity, and Excellence.
• 401(k) plan with employer matching.
• Health, dental, and vision insurance.
• Flexible work schedule, 11 paid holidays, and paid time off.
• Education assistance.