Signal Integrity & Power Integrity Principal Engineer

Location: San Jose, California, United States

Salary: $187,000–$270,000 USD annually for the Bay Area California region; incentive opportunities may also be available.

Company

hirify.global is an independent pure-play FPGA solutions provider developing programmable technologies for AI, cloud, networking, and edge markets.

What you will do

• Lead end-to-end signal and power integrity design for IC packages, validation platforms, and development-kit hardware.
• Define SI/PI simulation methodologies using advanced EDA tools and AI-assisted techniques.
• Simulate, review, and analyze package and board designs to deliver scalable electrical solutions.
• Diagnose system-level SI/PI challenges involving electrical, mechanical, thermal, and manufacturing constraints.
• Collaborate with silicon, package, and board design teams to optimize performance and product cost.
• Advance SI/PI technologies, including advanced and heterogeneous packaging solutions.

Requirements

• 15+ years of hands-on Signal Integrity and Power Integrity engineering experience across silicon, package, and board-level designs.
• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field.
• Strong knowledge of electromagnetics, circuit analysis, signal processing, high-speed digital interfaces, SI/PI fundamentals, and power delivery network behavior.
• Experience with simulation and modeling tools such as ANSYS HFSS, Synopsys HSPICE, Cadence Sigrity, or Keysight ADS.
• Experience with silicon, package, and board layout and design tools, such as Mentor Graphics and Cadence Allegro.
• Applicants must be eligible for any required U.S. export authorizations.

Nice to have

• Master’s or PhD in Electrical Engineering, Computer Engineering, or a related field.
• Scripting and automation experience with Python, MATLAB, or similar languages.

Culture & Benefits

• Regular full-time employment.
• Incentive opportunities based on individual and company performance.
• Work focused on FPGA technologies for AI, cloud, networking, and edge applications.
• Collaboration across silicon, package, and board design disciplines.