9 часов назад
Packaging Architect (Photonics)
218 000 - 317 000$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Packaging Architect (Photonics): Developing advanced 2D/3D packaging solutions for photonics-based AI and HPC data center infrastructure with an accent on optical packaging, high-speed interfaces, and electrical, thermal, and mechanical performance. Focus on evaluating silicon-to-package-to-system trade-offs, defining substrate and assembly requirements, and driving products from concept through production release.
Location: Mountain View, California, United States; flexible hybrid workplace model
Salary: $218,000–$317,000 USD per year, plus equity and additional rewards
Company
develops photonics-based infrastructure for AI and high-performance computing data centers, including its 3D-stacked Passage photonics engine.
What you will do
- Own advanced packaging architecture from concept through product release.
- Evaluate trade-offs across EIC/PIC layouts, die-to-die interfaces, fiber attachment methods, and packaging technologies.
- Define electrical, thermal, and mechanical packaging specifications aligned with performance, cost, schedule, and manufacturability goals.
- Partner with product architects, chip designers, system architects, supply chain engineering, suppliers, and Quality & Reliability teams.
- Establish substrate, assembly, raw material, qualification, and issue-resolution requirements.
- Monitor packaging technology trends and work with product teams and data center and HPC customers to influence roadmap direction.
Requirements
- Master’s or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field.
- 15+ years of experience with advanced 2D/3D packaging technologies and exposure to optical packaging.
- 10+ years of expertise in power or signal integrity, thermal-mechanical analysis, or optical packaging.
- Experience performing system-level trade-offs across silicon, package, and board for complex products.
- Extensive experience with SERDES, PCIe, die-to-die interconnects, substrate selection, signal integrity, and thermal management.
- Track record of delivering packages and products from concept through production release, with proficiency in industry-standard EDA and CAD tools.
Nice to have
- Technical leadership across complex, multidisciplinary projects and external supplier organizations.
- Strong independent decision-making, ambiguity management, communication, and practical problem-solving skills.
Culture & Benefits
- Medical, dental, and vision coverage.
- Retirement savings matching, life insurance, and short- and long-term disability coverage.
- Vacation, sick leave, public holidays, and paid family leave.
- Training and development opportunities, commuter benefits, and a flexible hybrid workplace.
- Equity grants for eligible full-time employees.
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