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9 часов назад

Packaging Architect (Photonics)

218 000 - 317 000$
Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Текст:
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TL;DR
Packaging Architect (Photonics): Developing advanced 2D/3D packaging solutions for photonics-based AI and HPC data center infrastructure with an accent on optical packaging, high-speed interfaces, and electrical, thermal, and mechanical performance. Focus on evaluating silicon-to-package-to-system trade-offs, defining substrate and assembly requirements, and driving products from concept through production release.

Location: Mountain View, California, United States; flexible hybrid workplace model

Salary: $218,000–$317,000 USD per year, plus equity and additional rewards

Company

hirify.global develops photonics-based infrastructure for AI and high-performance computing data centers, including its 3D-stacked Passage photonics engine.

What you will do

  • Own advanced packaging architecture from concept through product release.
  • Evaluate trade-offs across EIC/PIC layouts, die-to-die interfaces, fiber attachment methods, and packaging technologies.
  • Define electrical, thermal, and mechanical packaging specifications aligned with performance, cost, schedule, and manufacturability goals.
  • Partner with product architects, chip designers, system architects, supply chain engineering, suppliers, and Quality & Reliability teams.
  • Establish substrate, assembly, raw material, qualification, and issue-resolution requirements.
  • Monitor packaging technology trends and work with product teams and data center and HPC customers to influence roadmap direction.

Requirements

  • Master’s or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field.
  • 15+ years of experience with advanced 2D/3D packaging technologies and exposure to optical packaging.
  • 10+ years of expertise in power or signal integrity, thermal-mechanical analysis, or optical packaging.
  • Experience performing system-level trade-offs across silicon, package, and board for complex products.
  • Extensive experience with SERDES, PCIe, die-to-die interconnects, substrate selection, signal integrity, and thermal management.
  • Track record of delivering packages and products from concept through production release, with proficiency in industry-standard EDA and CAD tools.

Nice to have

  • Technical leadership across complex, multidisciplinary projects and external supplier organizations.
  • Strong independent decision-making, ambiguity management, communication, and practical problem-solving skills.

Culture & Benefits

  • Medical, dental, and vision coverage.
  • Retirement savings matching, life insurance, and short- and long-term disability coverage.
  • Vacation, sick leave, public holidays, and paid family leave.
  • Training and development opportunities, commuter benefits, and a flexible hybrid workplace.
  • Equity grants for eligible full-time employees.

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