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11 часов назад

Signal Integrity (AI Hardware)

120 000 - 300 000$
Тип работы
fulltime
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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TL;DR
Signal Integrity (AI Hardware) (DDR/PCIe/USB/MIPI): Analyzing and validating high-speed interfaces and power distribution networks for compact AI-powered hardware with an accent on SI/PI simulations, PCB stackup definition, and lab measurements. Focus on modeling SerDes channels, correlating simulations with hardware, mitigating EMI/EMC issues, and developing scalable design rules.

Location: San Jose, United States

Salary: $120,000–$300,000 annually

Company

hirify.global develops personalized, multimodal artificial intelligence and next-generation hardware interfaces that interact with people and the physical world.

What you will do

  • Perform pre-layout and post-layout signal integrity simulations for DDR4/5, PCIe Gen3/4, USB 3.x, and MIPI CSI/DSI interfaces.
  • Model and optimize power distribution networks, including decoupling, plane resonance, and target impedance.
  • Build SerDes channel models, analyze eye diagrams, and validate compliance margins.
  • Define PCB stackups, impedance profiles, routing constraints, and SI/PI design rules.
  • Conduct laboratory measurements with oscilloscopes, VNAs, TDRs, spectrum analyzers, and EMI probes.
  • Identify and mitigate board- and system-level EMI/EMC issues while supporting regulatory certification.

Requirements

  • BS or MS in Electrical Engineering with a focus on electromagnetics, RF, or signal integrity.
  • Hands-on experience with SI/PI tools such as Ansys HFSS, Keysight ADS/PathWave, Cadence Sigrity, or Simbeor.
  • Deep knowledge of DDR, PCIe, USB, and/or MIPI signaling standards and compliance testing.
  • Expert-level skills with high-bandwidth oscilloscopes, VNAs, TDR equipment, and near-field EMI probes.
  • Strong understanding of multilayer PCB fabrication, Dk/Df materials, and controlled-impedance routing.

Nice to have

  • Experience with LPDDR5 or high-speed memory interfaces for mobile or edge-compute platforms.
  • RFIC or antenna design experience for Wi-Fi, Bluetooth, or UWB systems.
  • Familiarity with 3D electromagnetic solvers for package-level or connector modeling.
  • Experience supporting FCC, CE, or VCCI EMC certification from design through testing.

Culture & Benefits

  • Work on multimodal AI systems and custom hardware developed as a unified platform.
  • Full-time position with an annual US base salary range of $120,000–$300,000.
  • Total compensation may include additional components and benefits depending on the role.

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