Quantum Superconducting Interconnect Integration Engineer (Quantum Packaging)

Location: Malta, New York, USA

Salary: $143,000–$247,000 per year, depending on qualifications, experience, and location.

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services across a global manufacturing footprint.

What you will do

• Lead development and integration of superconducting interconnect and interposer processes using materials such as niobium, aluminum, and indium.
• Develop 2.5D and 3D cryogenic interposer architectures for quantum systems, including qubit dies, control electronics, and superconducting interposers.
• Define routing, metallization, density, pitch, and integration schemes optimized for low-loss RF/microwave propagation, minimal thermal leakage, and cryogenic reliability.
• Own wafer-level and die-level integration flows, including redistribution layers, TSV/TOV formation, bumps, bonding, and assembly interfaces.
• Enable prototyping, transition processes to scalable manufacturing, and improve yield, manufacturability, cost, and cycle time.
• Collaborate with device, test, assembly, reliability, modeling, OSAT, supplier, and research teams to validate solutions at cryogenic conditions.

Requirements

• Master’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field from an accredited program.
• At least 10 years of related work experience with a master’s degree.
• Overall GPA of at least 3.0 and proven good academic standing.
• English fluency required for written and verbal communication.
• Experience with interconnect or interposer integration, superconducting materials and interfaces, advanced packaging, or cryogenic integration.
• Availability to travel up to 20%.

Nice to have

• PhD education level with at least 8 years of related work experience.
• Leadership experience and strong project management, planning, organizational, written, and verbal communication skills.

Culture & Benefits

• Full-time employment within a diverse and inclusive semiconductor manufacturing environment.
• Participation in environmental, health, safety, and security programs is expected.
• Opportunity to mentor new hires and contribute to hiring Advanced Packaging team members in Singapore.
• Contribute to intellectual property, publications, conference outputs, and advanced packaging roadmaps.