Advanced Packaging Lead (Quantum Computing)

Location: Delft, Netherlands. The role is listed as on-site, with a hybrid setup also offered.

Company

hirify.global develops quantum processors using VIO™ technology and advanced multilayer chip-stack architectures.

What you will do

• Plan and lead back-end fabrication and assembly technology development for quantum processors.
• Enhance flip-chip bonding techniques, contact reliability, and manufacturability within the chip-stack architecture.
• Develop and coordinate integration test plans with cross-functional teams.
• Define and formalize assembly-focused fabrication and process development across the organization.
• Establish scalable, documented integration procedures and investigate technical anomalies against specifications and performance targets.

Requirements

• 4+ years of experience in chip assembly development for deep-tech or low-volume technology, preferably involving flip-chip processes in quantum computing.
• Hands-on experience with back-end process-flow development, including UBM, hard-stops, bumps, detachable contacts, MEMS, and flip-chip technologies.
• Background in physics, microwave/RF engineering, electrical engineering, or a related field.

Nice to have

• Background in superconducting qubits.
• PhD.

Culture & Benefits

• High-performing environment with world-class experts and an ambitious, fast-moving team.
• Competitive salary with an 8% holiday allowance.
• Pension plan with partner and dependent coverage.
• Flexible, outcome-focused work with a hybrid setup and open vacation policy.
• Learning and development budget based on individual ambitions, development needs, and performance.
• Team events, offsites, and other opportunities to connect and celebrate achievements.

Hiring process

• Pre-employment screening may be required.