3D Integration and Advanced Packaging Lead

Location: London, UK — hybrid

Company

hirify.global is a London-based quantum computing scale-up developing scalable quantum processors based on industrial-grade silicon chips.

What you will do

• Build, recruit, mentor, and lead a high-performing team of packaging, signal integrity, materials, and quantum integration engineers.
• Drive the strategy, design, and rapid prototyping of 3D integrated circuits and multi-chip quantum modules using TSVs and fine-pitch microbumps.
• Develop packaging architectures and interconnects that withstand thermal cycling to millikelvin temperatures without delamination or performance degradation.
• Manage technical operations and design transfers with external foundries, OSATs, and research partners.
• Coordinate electrical, thermal, mechanical, cryogenic, process integration, and quantum hardware requirements.
• Balance rapid R&D prototyping with yield improvement, failure analysis, and long-term reliability work.

Requirements

• Master’s degree or PhD in electrical engineering, materials science, physics, microelectronics, or a related field.
• 7+ years of deep technical experience in 3D integration, including TSVs, fine-pitch microbumps, flip-chip bonding, or multi-chip modules.
• Proven experience building, scaling, and managing engineering teams in high-tech, fast-paced environments.
• Strong experience managing technical transfers and working with external semiconductor foundries or advanced packaging facilities.

Nice to have

• Experience with Ansys HFSS/Q3D, Cadence, or comparable simulation tools for signal integrity, thermal stress, and mechanical modelling.
• Direct experience with cryogenic electronics.
• Familiarity with solid-state quantum mechanics, silicon spin qubits, or semiconductor physics.
• Knowledge of superconductors and low-loss dielectric behaviour at extreme temperatures.

Culture & Benefits

• Collaborative, interdisciplinary R&D environment focused on scalable silicon-based quantum computing.
• Competitive salary and share options scheme.
• Contributory pension and group private medical insurance.
• Life assurance and cycle-to-work scheme.
• Central London location.