Optical - Director, OE Development (DOD)

Location: Bay Area, on-site

Company

Building NuLink, a proprietary die-to-die chiplet interconnect fabric for hyperscale AI infrastructure and expanding into co-packaged optics.

What you will do

• Define the optical product strategy for die-level co-packaging of external optical components with silicon.
• Own the selection and qualification of VCSELs, photodetectors, lenses, fiber connectors, and optical subassemblies.
• Develop assembly-aware optical specifications covering flip-chip tolerances, solder reflow, alignment accuracy, and packaging design rules.
• Coordinate optical and silicon teams on optical-electrical co-design within foundry process boundaries.
• Partner with Marketing on product positioning, customer-facing specifications, and roadmap priorities.
• Report execution status and product milestones to the COA.

Requirements

• 12+ years of experience in optical systems or photonic integration.
• Hands-on experience with semiconductor fabrication, assembly, or advanced packaging environments.
• Strong knowledge of FEOL/BEOL concepts, lithography constraints, metal layer stackups, and process design rules.
• Deep understanding of co-packaging architectures, including flip-chip bonding, micro-bump interconnects, or interposer-based integration.
• Experience integrating third-party optical components into semiconductor packages and evaluating optical alignment yield.
• Strong cross-functional communication across silicon, packaging, and marketing teams.

Nice to have

• Experience with IEEE 802.3, OIF, or the CPO Consortium.

Culture & Benefits

• Full-time engineering position with on-site work in the Bay Area.
• Hiring decisions are made with human judgment; AI tools may assist with application review and assessment.