Expert IC Package Design Lead (Semiconductor)

Location: Israel

Company

hirify.global develops rack-scale AI infrastructure and semiconductor-based connectivity solutions integrating CXL, Ethernet, NVLink, PCIe, UALink, and software technologies.

What you will do

• Own IC package design from architecture and feasibility through detailed design, qualification, tape-out, and high-volume manufacturing.
• Define package architectures and technology selections, including organic substrates, advanced laminates, interposers, and 2.5D/3D chiplet packaging.
• Lead package-level signal integrity, power integrity, thermal, mechanical, and cost trade-offs for high-speed, high-power devices.
• Drive package layout, substrate routing, bump and ball maps, stack-ups, material selection, and mechanical constraints.
• Collaborate with silicon, SerDes, system, SI/PI, reliability, manufacturing, OSAT, and substrate partners.
• Lead risk assessment, failure analysis, corrective actions, NPI, qualification, vendor audits, and product sustainment.

Requirements

• 10+ years of hands-on IC package design experience for high-performance semiconductor products, with ownership from concept through tape-out.
• Expert proficiency with Cadence APD, SiP, or equivalent IC package design tools.
• Experience designing complex BGA, FCBGA, and FCCSP packages.
• Strong expertise in package architecture and integration, including stack-ups, bump and ball maps, constraints, SMT integration, and package BOM ownership.
• Deep understanding of package-level signal, power, and thermal integrity, plus manufacturing and release processes including DRC, LVS, DFM, and OSAT engagement.

Nice to have

• Experience with AI, networking, PCIe, CXL, or other high-speed data center interfaces.
• Familiarity with JEDEC, IPC, thermal cycling, HTOL, and other package reliability and qualification standards.
• Experience with chiplet-based architectures and heterogeneous integration.
• Technical leadership or package ownership on high-volume products.

Culture & Benefits

• Opportunity to help establish a strategic R&D center in Israel.
• Work on connectivity silicon for large-scale AI and cloud environments.
• Inclusive environment encouraging applications from people with diverse backgrounds and experiences.