Senior Integrated Photonics Packaging Engineer (m/f/d)

Location: Stuttgart, Germany

Company

hirify.global develops photonic processing systems that use light for scalable, energy-efficient AI computing and high-performance computing.

What you will do

• Define and own high-density electro-optical and RF packaging solutions with strong signal and power integrity.
• Lead supplier-driven R&D projects from technical specifications and contract negotiations through system integration and validation.
• Perform electromagnetic modeling, package co-simulation, transmission-line analysis, S-parameter measurements, and EMC shielding design.
• Drive design for manufacturability, PCB and package layout, and the use of advanced HTCC, LTCC, HDI, and build-up substrate technologies.
• Develop thermal management strategies for high-power photonic and high-frequency devices.
• Establish verification protocols targeting at least 95% first-pass qualification and introduce new packaging materials, processes, or high-frequency architectures.

Requirements

• M.Sc. or Ph.D. in Electrical Engineering, Photonics, Optoelectronics, Physics, or a related field; equivalent industry experience is considered.
• At least 5 years of hands-on experience in RF packaging, optoelectronic integration, or high-density interconnect technologies.
• Experience managing supplier-led R&D projects from requirements definition through integration and validation.
• Deep expertise in RF signal and power integrity, electromagnetic simulation tools, S-parameter measurements, and EMC shielding.
• Background in semiconductor backend integration, thermal management, advanced packaging substrates, CAD tools, SPC, and standards such as Telcordia and JEDEC.
• Fluent English required. German or another European language is a plus.

Culture & Benefits

• Work on novel high-frequency packaging architectures for photonic AI computing.
• Help transition photonic computing from prototypes to scalable, high-yield mass production.
• Enjoy broad autonomy in technical strategy, supplier selection, design rules, and packaging technology decisions.
• Collaborate with specialists in photonics, RF design, processor architecture, and AI systems.
• Work directly with the Head of PIC, company founders, and an experienced semiconductor advisory board.