Senior/ Staff Package Design Engineer

Location: Israel

Company

Provides rack-scale AI infrastructure through semiconductor-based connectivity solutions integrating CXL, Ethernet, NVLink, PCIe, UALink, and supporting software.

What you will do

• Own end-to-end IC package design from early feasibility and detailed design through qualification and high-volume manufacturing.
• Implement package architectures using organic substrates, advanced laminates, interposers, multi-die and chiplet packaging, and CoWoS 2.5D/3D integration.
• Drive package-level signal integrity, power integrity, thermal, electrical, mechanical, and cost tradeoffs for high-speed, high-power devices.
• Perform package layout, substrate routing, bump and ball maps, stack-ups, materials selection, and mechanical constraint definition.
• Collaborate with silicon, SerDes, system, SI/PI, reliability, manufacturing, OSAT, and substrate vendor teams.
• Support DFM, yield and cost targets, risk assessments, failure analysis, corrective actions, NPI, qualification, and production ramp.

Requirements

• 5+ years of hands-on IC package design experience for high-performance semiconductor products, with ownership from concept through tape-out.
• Expertise with Cadence APD, SiP, or equivalent IC package design tools.
• Experience designing complex BGA, FCBGA, or FCCSP packages.
• Strong package integration expertise covering stack-ups, ball and bump maps, constraints, SMT integration, and package BOM ownership.
• Deep understanding of package-level signal, power, and thermal integrity, including design tradeoffs based on analysis.
• Manufacturing and release experience with DRC, LVS, DFM, OSAT engagement, and production-ready package designs.

Nice to have

• Experience with AI, networking, PCIe, CXL, or other high-speed data center interfaces.
• Familiarity with JEDEC and IPC reliability standards and qualification methods such as thermal cycling and HTOL.
• Experience with chiplet-based architectures and heterogeneous integration.
• Track record of complete technical package ownership on high-volume products.

Culture & Benefits

• Opportunity to contribute to a new strategic R&D center in Israel.
• Work on connectivity silicon supporting large-scale AI and cloud environments.
• Collaborative environment involving silicon, signal integrity, power integrity, mechanical, manufacturing, reliability, and external partners.
• Inclusive workplace encouraging applications from people with diverse backgrounds and experiences.