Advanced Packaging Electrical / Signal Integrity Architect (Semiconductor)

Location: On-site in Aachen, Germany

Company

hirify.global develops graphene photonic solutions that connect chips into high-throughput, low-delay, energy-efficient computing networks.

What you will do

• Own electrical characterization and signoff for advanced semiconductor packages, including equivalent circuit modeling, signal integrity, power integrity, crosstalk, and EMI/EMC analysis.
• Develop and validate RLGC-equivalent circuit and S-parameter models for 2.5D/3D, interposer, fan-out, and chiplet-based packages.
• Analyze high-speed SerDes, HBM, and die-to-die interconnects across die-package-board interfaces.
• Define package stack-ups, substrate routing guidelines, via strategies, and bump-map/ball-out architectures in collaboration with ASIC and packaging teams.
• Build and correlate SI/PI and electromagnetic simulation models against laboratory measurements for package signoff and end-to-end channel performance.
• Collaborate with ASIC, SerDes, system, OSAT, and foundry teams on chip-package-board co-simulation, qualification, manufacturing, and DFM compliance.

Requirements

• Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, Physics, or a related field, or equivalent experience.
• 6+ years of experience in package or PCB signal integrity, power integrity, high-speed interconnect design, advanced packaging, or related hardware engineering.
• Strong knowledge of transmission line theory, electromagnetics, S-parameters, channel modeling, package equivalent electrical models, and SI/PI analysis.
• Hands-on experience with SI/PI and electromagnetic tools such as Ansys HFSS/SIwave, Cadence Sigrity, Keysight ADS, or HSPICE.
• Experience validating and correlating simulation models with laboratory measurements using VNA, TDR, high-speed oscilloscopes, or similar instrumentation.
• Working knowledge of advanced packaging technologies and scripting or automation with Python, Perl, Tcl, Cadence SKILL, or similar languages.

Nice to have

• Experience working with OSAT partners on package electrical qualification, advanced package manufacturing, or DFM activities.
• Experience with electrical/optical co-packaging, EIC-to-PIC interfaces, bump-map signoff, or UCIe-class interconnects.
• Participation in IEEE, OIF, JEDEC, or similar industry standards organizations.

Culture & Benefits

• Human-centric, flexible work culture focused on work-life harmony.
• Autonomy and continuous learning with support for professional and personal development.
• Benefits including insurance, pension, and virtual stock options.
• Open, inclusive, and collaborative environment focused on innovation and growth.