Senior Integrated Photonics Packaging Engineer (AI)

Location: Stuttgart, Germany; onsite

Company

hirify.global develops photonic processing systems that compute with light as an energy-efficient alternative to transistor-based architectures for AI and high-performance computing.

What you will do

• Define and own optical packaging architecture and high-density packaging solutions for photonic processing systems.
• Lead supplier-driven R&D projects from requirements and contract negotiation through system integration and validation.
• Develop optical coupling strategies, including butt-coupling, grating coupling, and fiber-array integration.
• Design thermal management concepts and drive Design for Manufacturability across polymers, ceramics, metals, and semiconductor back-end integration.
• Perform 8D and Ishikawa root-cause analysis on integration failures, targeting at least 95% first-pass qualification.
• Collaborate with R&D, systems, manufacturing, and test teams to introduce proprietary packaging concepts and architectures.

Requirements

• Master’s degree or Ph.D. in Photonics, Optoelectronics, Electrical Engineering, Physics, or a related field; equivalent industry experience may be considered.
• At least 5 years of hands-on experience in photonics packaging, optoelectronic integration, or high-density interconnect technologies.
• Experience managing supplier-led R&D projects from requirements definition through integration and validation.
• Hands-on expertise with PICs, laser sources, photodetectors, analog electronics, and semiconductor back-end integration.
• Expertise in optical coupling, thermal management, DFM, and optical design tools such as Zemax or CODE V, as well as 8D and Ishikawa methodologies.
• Fluent English required; German or another European language is a plus.

Culture & Benefits

• Work on proprietary high-density photonic packaging architectures for AI and HPC.
• Broad autonomy to define technical requirements, select suppliers, manage budgets, and develop new packaging concepts.
• Collaborate with an international, cross-functional team spanning photonics, processor design, and AI systems.
• Work directly with the Head of PIC, company founders, and an experienced semiconductor advisory board.