5 часов назад
Mechanical Engineer (AI Infrastructure)
102 000GBP
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Mechanical Engineer (AI Infrastructure): Designing and developing mechanical systems for next-generation compute platforms from concept and architecture through prototype builds, qualification, and production release with an accent on thermal management, structural integrity, manufacturability, and rack-scale integration. Focus on integrating liquid cooling and dense electronics, conducting FEA/CFD analysis, and solving complex mechanical and thermal issues across multidisciplinary hardware systems.
Location: On-site in London, UK
Starting from £102,000 per year
Company
develops the Decode Accelerator 1 (DX-1), a rack-scale compute platform designed to improve performance and efficiency for AI infrastructure through co-designed logic, data movement, packaging, optics, and interconnects.
What you will do
- Own mechanical architecture for chassis, enclosures, structural assemblies, cooling systems, and rack-integrated hardware from concept through production release and lifecycle support.
- Design solutions balancing thermal performance, mechanical robustness, serviceability, manufacturability, scalability, and cost.
- Create CAD models, engineering drawings, bills of materials, and technical documentation using GD&T and DFM/DFA/DFR/DFS principles.
- Drive airflow optimisation, liquid cooling integration, cold-plate design, and system-level heat rejection.
- Define interfaces between compute, networking, power, optical, and cooling subsystems, including rack-level structural, cable, airflow, and service-access design.
- Support analysis, prototype builds, qualification testing, production release, root-cause investigations, supplier coordination, and cross-functional design reviews.
Requirements
- Degree in Mechanical Engineering or a related discipline, with experience developing complex electromechanical products through production.
- Experience owning mechanical systems, chassis, or infrastructure across the full product lifecycle.
- Experience with dense electronics, optical subsystems, networking, or compute hardware with demanding thermal and power-density requirements.
- Strong knowledge of structural design, materials, tolerancing, manufacturability, thermal management, forced-air and liquid cooling, cold plates, thermal interface materials, and airflow optimisation.
- Strong 3D CAD experience with Creo, SolidWorks, NX, or equivalent, plus GD&T and ASME Y14.5.
- Experience with FEA/CFD, vibration and airflow analysis, manufacturing processes, NPI, prototype qualification, production ramp, suppliers, and contract manufacturers.
Nice to have
- Experience developing rack-scale or data-centre hardware platforms.
- Hands-on liquid cooling integration at scale, including cold plates, manifolds, and CDUs.
- Experience with AI/ML compute infrastructure, high-density accelerator systems, photonic or optical subsystems, configuration management, or PLM tools.
Culture & Benefits
- Meaningful stock options and ownership participation.
- Annual Living-Local Bonus for employees living within 20 minutes of the office.
- Employer-contributed retirement plans.
- Fast-moving, multidisciplinary engineering environment.
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