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5 часов назад

Mechanical Engineer (AI Infrastructure)

102 000GBP
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
UK
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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TL;DR
Mechanical Engineer (AI Infrastructure): Designing and developing mechanical systems for next-generation compute platforms from concept and architecture through prototype builds, qualification, and production release with an accent on thermal management, structural integrity, manufacturability, and rack-scale integration. Focus on integrating liquid cooling and dense electronics, conducting FEA/CFD analysis, and solving complex mechanical and thermal issues across multidisciplinary hardware systems.

Location: On-site in London, UK

Starting from £102,000 per year

Company

hirify.global develops the Decode Accelerator 1 (DX-1), a rack-scale compute platform designed to improve performance and efficiency for AI infrastructure through co-designed logic, data movement, packaging, optics, and interconnects.

What you will do

  • Own mechanical architecture for chassis, enclosures, structural assemblies, cooling systems, and rack-integrated hardware from concept through production release and lifecycle support.
  • Design solutions balancing thermal performance, mechanical robustness, serviceability, manufacturability, scalability, and cost.
  • Create CAD models, engineering drawings, bills of materials, and technical documentation using GD&T and DFM/DFA/DFR/DFS principles.
  • Drive airflow optimisation, liquid cooling integration, cold-plate design, and system-level heat rejection.
  • Define interfaces between compute, networking, power, optical, and cooling subsystems, including rack-level structural, cable, airflow, and service-access design.
  • Support analysis, prototype builds, qualification testing, production release, root-cause investigations, supplier coordination, and cross-functional design reviews.

Requirements

  • Degree in Mechanical Engineering or a related discipline, with experience developing complex electromechanical products through production.
  • Experience owning mechanical systems, chassis, or infrastructure across the full product lifecycle.
  • Experience with dense electronics, optical subsystems, networking, or compute hardware with demanding thermal and power-density requirements.
  • Strong knowledge of structural design, materials, tolerancing, manufacturability, thermal management, forced-air and liquid cooling, cold plates, thermal interface materials, and airflow optimisation.
  • Strong 3D CAD experience with Creo, SolidWorks, NX, or equivalent, plus GD&T and ASME Y14.5.
  • Experience with FEA/CFD, vibration and airflow analysis, manufacturing processes, NPI, prototype qualification, production ramp, suppliers, and contract manufacturers.

Nice to have

  • Experience developing rack-scale or data-centre hardware platforms.
  • Hands-on liquid cooling integration at scale, including cold plates, manifolds, and CDUs.
  • Experience with AI/ML compute infrastructure, high-density accelerator systems, photonic or optical subsystems, configuration management, or PLM tools.

Culture & Benefits

  • Meaningful stock options and ownership participation.
  • Annual Living-Local Bonus for employees living within 20 minutes of the office.
  • Employer-contributed retirement plans.
  • Fast-moving, multidisciplinary engineering environment.

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