Global Application Leader (Laminates)

Location: Hsinchu City, Hsinchu County, Taiwan

Company

hirify.global develops materials and solutions for advanced electronics and high-tech industries.

What you will do

• Lead and develop a global application team across Asia, the United States, and Europe, including talent development, resource allocation, and performance management.
• Define and execute the global application strategy in alignment with business priorities, technology roadmaps, and long-term growth objectives.
• Engage OEMs, fabricators, and value-chain partners in consumer electronics, AI data centers, industrial, and other strategic markets.
• Translate customer and market needs into material requirements, technical programs, product-development priorities, and commercially relevant solutions.
• Manage the global application opportunity pipeline, including priorities, milestones, ownership, resources, and expected business impact.
• Lead rapid prototyping and communicate application strategy, project status, technical risks, resource needs, and business opportunities to senior stakeholders.

Requirements

• Master’s degree or higher in chemistry, chemical engineering, materials science, or a related field.
• At least 10 years of relevant industry experience, including significant experience with laminate materials, printed circuit boards, electronics materials, or related applications.
• Experience leading regional or global technical teams and developing talent across multiple geographies.
• Strong strategic thinking, prioritization, problem-solving, and program-management capabilities.
• Excellent written and verbal communication skills, including presentations for customers and senior management.
• Professional proficiency in English and Mandarin is required; international travel is required as needed.

Culture & Benefits

• Work in a global, cross-cultural, multidisciplinary environment.
• Collaborate with Commercial, Business Development, R&D, and Manufacturing functions.
• Opportunity to contribute to advanced electronics and high-tech applications.
• Comprehensive pay and benefits package.