Manufacturing Technical Program Manager (Semiconductor Manufacturing)

Location: Menlo Park, California, United States

Annual salary: $150,000–$220,000 USD

Company

hirify.global develops wired THz transceiver technology and advanced interconnects for high-speed AI data center hardware.

What you will do

• Own end-to-end technical execution of new product introduction programs from technology development through production ramp.
• Drive concurrent development across R&D, wafer fabs, OSATs, manufacturing engineering, and contract manufacturers.
• Lead wafer fabrication industrialization, including lithography, deposition, etch, CMP, metrology, and yield ramp.
• Define technology readiness milestones, build gates, technical risk mitigation, and technical change control.
• Transition technologies from pilot builds into high-volume fabrication and manufacturing environments.
• Establish yield learning, statistical process control, and reliability strategies while leading root-cause resolution.

Requirements

• Bachelor’s degree in engineering or a related discipline; a master’s degree is preferred.
• 8+ years of experience in technology development, wafer fabrication, or advanced manufacturing NPI.
• Experience leading wafer-level or semiconductor-based products through production ramp.
• Experience managing complex technical programs across multiple teams, sites, and manufacturing partners.
• Direct experience working with wafer fabs, OSATs, and external manufacturing partners.

Nice to have

• Hands-on experience with silicon wafer fabrication processes such as lithography, etch, deposition, CMP, and metrology.
• Experience with advanced packaging or interposers.
• Familiarity with high-performance wires, cables, connectors, or other interconnects.
• Experience with datacenter, HPC, or performance-critical hardware.

Culture & Benefits

• Commitment to a diverse and inclusive workplace.
• Equal employment opportunities for all applicants and employees.