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9 часов назад

Package Reliability Engineer

Формат работы
hybrid
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
Germany
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Package Reliability Engineer (Semiconductor Packaging): Owning the reliability of packaged semiconductor products from mission-profile definition and target allocation through qualification, failure analysis, and release recommendations with an accent on package-level reliability, high-speed I/O, RF, and optical interfaces. Focus on designing risk-based qualification strategies, investigating failure mechanisms with advanced analysis techniques, and driving evidence-based improvements for novel graphene and optical interconnect technologies.

Location: Aachen, Germany; hybrid

Company

hirify.global develops graphene photonic solutions that connect chips into high-throughput, low-delay, energy-efficient computing networks.

What you will do

  • Own mission profiles and reliability targets, including operating conditions, FIT, MTBF, and lifetime allocation across package, interconnect, and device contributors.
  • Assess package-level failure mechanisms across substrates, die attach, interconnects, solder joints, board attach, and optical or fiber interfaces.
  • Define and execute thermal, mechanical, environmental, and board-level qualification plans using applicable industry and customer requirements.
  • Lead technical collaboration with OSATs, substrate suppliers, and external laboratories, reviewing qualification evidence and reliability data.
  • Drive root-cause investigations and failure analysis using X-ray, C-SAM, cross-sectioning, SEM/EDX, and related methods.
  • Provide risk-based recommendations for design improvements, requalification, customer sampling, qualification milestones, and production release.

Requirements

  • Master's degree or equivalent experience in Electrical Engineering, Microelectronics, Materials Science, Reliability Engineering, or a related field.
  • 3–5+ years of experience evaluating semiconductor package construction and associated failure mechanisms.
  • Understanding of high-speed I/O and RF reliability, including signal integrity, insertion loss, jitter, and eye closure over product lifetime.
  • Experience with FIT and MTBF calculations, mission profiles, acceleration models, and measurable reliability targets.
  • Knowledge of JEDEC, AEC-Q100/Q006, IPC, and IEC qualification standards.
  • Strong failure analysis, cross-functional communication, ownership, adaptability, and startup-environment skills.

Nice to have

  • Experience with photonics reliability.
  • Experience developing qualification strategies for novel packaging technologies such as UBC and optical interconnects.

Culture & Benefits

  • Flexible, human-centered work culture focused on work-life harmony.
  • Autonomy and continuous learning with support for professional and personal development.
  • Comprehensive insurance, pension, and virtual stock options.
  • Open, inclusive, and collaborative environment that values individuality and innovation.

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