Senior IC Packaging Engineer

Location: Ho Chi Minh City, Vietnam

Company

hirify.global develops secure AI-powered digital infrastructure based on its Trusted Control/Compute Unit semiconductor technology.

What you will do

• Provide technical leadership and architectural ownership for IC and System-in-Package packaging across multiple products and programs.
• Define package architectures and technology roadmaps spanning 2D, RDL-based fan-out 2.5D, chiplet, and heterogeneous integration designs.
• Lead chiplet packaging strategies involving UCIe, silicon interposers, advanced RDL, bump architectures, and substrate stack-ups.
• Guide hands-on package design and physical layout for high-speed SerDes/PHY, PCIe, CXL, LPDDR5, UCIe, and other multi-gigabit interfaces.
• Drive signal integrity, power integrity, thermal, mechanical, reliability, DFM, cost, yield, schedule, and risk trade-offs.
• Coordinate technology development and manufacturing readiness with foundries, OSATs, substrate suppliers, and cross-functional teams.

Requirements

• BSEE or MSEE in Electrical Engineering or a related field; PhD is a plus.
• 10+ years of extensive IC packaging experience for SoCs, ASICs, or memory products.
• Deep hands-on expertise in flip-chip BGA, System-in-Package, RDL, silicon interposers, and UCIe chiplet architectures.
• Experience leading end-to-end packaging programs from early architecture through high-volume production.
• Experience with high-speed SerDes package development, including PCIe Gen5, LPDDR5/LPDDR5X, USB 3.x, or 10G interfaces.
• Strong cross-functional leadership and direct collaboration with OSATs, foundries, substrate suppliers, design, product, test, operations, reliability, and customer teams.

Nice to have

• Experience with Cadence Allegro Package Designer or equivalent EDA tools.
• SI/PI expertise, including S-parameter extraction and PDN optimization with HFSS, SIwave, or Ansys Designer.
• Experience building packaging methodologies or platforms from scratch.
• PhD in Electrical Engineering or a related field.

Culture & Benefits

• Fast-growing startup environment focused on silicon, systems, AI, and security innovation.
• Work alongside teams developing technology for data centers, cloud platforms, and AI infrastructure.
• Culture emphasizing curiosity, execution, respect, continuous learning, and practical problem-solving.
• Diverse and multifaceted work environment with cross-functional collaboration.