Package & SI/PI - Signal and Power Integrity Engineer

Location: On-site in Vancouver or Burnaby, BC, Canada, or the Bay Area, California, United States. Relocation is not available for this role.

Company

hirify.global is an early-stage chiplet startup developing high-performance, manufacturable chiplet interconnect technologies.

What you will do

• Define IO requirements with analog circuit designers through channel co-design.
• Run and optimize pre-layout and post-layout channel simulations.
• Use driver and receiver models for transient simulations, inspect eye diagrams, and improve performance.
• Design power delivery networks, extract models, and perform DC, AC, and transient simulations.
• Apply substrate and interposer manufacturing design rules and guide layout implementation.
• Perform laboratory measurements, correlate results with simulations, identify issues, and develop solutions.

Requirements

• Expertise in signal integrity and power integrity simulation methodologies.
• Experience with HFSS, Q3D, Siwave, PowerDC, PowerSI, ADS, Spectre, HSPICE, and Allegro.
• Knowledge of laboratory equipment including vector network analyzers, spectrum analyzers, and high-frequency oscilloscopes.
• BS degree in electrical engineering or equivalent, with 5 years of experience.
• On-site availability in Vancouver or Burnaby, BC, or the Bay Area, California; relocation is not available.

Nice to have

• Experience with IC packaging, manufacturing, and advanced package design.
• Knowledge of SERDES design and IBIS-AMI model creation.
• MS degree in electrical engineering or equivalent, with 7 years of experience.

Culture & Benefits

• Fast-paced early-stage startup environment.
• Cross-functional collaboration with industry experts.
• Focus on first-principles engineering, innovation, high volume, performance, manufacturability, and design flexibility.
• Fun work environment with excellent benefits.