Package & SI/PI - Signal and Power Integrity Engineer

Location: On-site in Vancouver or Burnaby, BC, Canada, or the Bay Area, California, United States; relocation is not available at this time.

Company

hirify.global is an early-stage chiplet startup developing high-performance, manufacturable chiplet-based systems.

What you will do

• Define IO requirements with analog circuit designers and co-design them with the channel.
• Perform pre-layout and post-layout channel simulations and optimize performance.
• Run transient channel simulations using driver and receiver models, inspect eye diagrams, and identify improvements.
• Design power delivery networks, extract models, and perform DC, AC, and transient simulations.
• Apply substrate and interposer manufacturing design rules and assembly requirements to package layouts.
• Perform laboratory measurements, correlate results with simulations, and provide solutions to identified issues.

Requirements

• Expertise in signal integrity and power integrity simulation methodologies.
• Experience with HFSS, Q3D, Siwave, PowerDC, PowerSI, ADS, Spectre, HSPICE, or Allegro.
• Knowledge of Vector Network Analyzers, Spectrum Analyzers, and high-frequency oscilloscopes.
• BS degree in electrical engineering or equivalent and 5 years of experience.
• On-site availability in Vancouver or Burnaby, BC, or the Bay Area, California, is required; relocation is not available at this time.

Nice to have

• Experience with IC packaging, manufacturing, and advanced package design.
• Knowledge of SERDES design and IBIS-AMI model creation.
• MS degree in electrical engineering or equivalent and 7 years of experience.

Culture & Benefits

• Fast-paced early-stage startup environment.
• Cross-functional collaboration with industry experts.
• Focus on first-principles engineering, innovation, and high-volume manufacturable products.
• Fun work environment and excellent benefits.