Wire Bond Manufacturing Engineer (Semiconductor Packaging)

Location: Singapore

Company

Building photonics infrastructure for AI supercomputing and developing advanced photonic technology.

What you will do

• Develop, characterize, qualify, optimize, and sustain thermosonic ball, wedge, and ribbon bonding processes for gold, copper, and aluminum wire systems.
• Establish process specifications, bond recipes, work instructions, control plans, FMEAs, and traceability documentation.
• Lead root cause analysis, CAPA, SPC, DOE, process capability improvements, and defect reduction for wire bond operations.
• Own the uptime, throughput, cycle time, and performance of ASM, Kulicke & Soffa, Shinkawa, Hesse, and other wire bonding equipment.
• Lead equipment installation, qualification, and buy-off, troubleshoot equipment issues, and coordinate technical escalations with vendors.
• Partner with Product, Design, Process Integration, Test, Quality, and Reliability teams on NPI, failure analysis, qualification builds, customer submissions, and cost reduction.

Requirements

• Bachelor’s degree in Electrical, Mechanical, Materials Science, or a related engineering discipline.
• 3–7 years of hands-on wire bond process or equipment engineering experience in semiconductor assembly, such as OSAT or IDM.
• Knowledge of ball, wedge, and/or ribbon bonding processes, failure modes, wire pull and ball shear testing.
• Experience with DOE, SPC, root cause analysis, and CAPA methods.
• Familiarity with wire bond equipment platforms including ASM, Kulicke & Soffa, Shinkawa, Hesse, or West Bond.
• Understanding of JEDEC, MIL-STD-883, IPC, and reliability testing; willingness to support shifts or production-floor needs.

Nice to have

• Experience with high-volume power semiconductor, RF/microwave, automotive, or optoelectronics packaging.
• Exposure to copper wire bonding, fine-pitch bonding below 50 µm, and multi-tier or stacked-die bonding.
• Six Sigma Green Belt or Black Belt certification.
• Experience with Minitab, JMP, MES/data systems, AOI/vision systems, or cleanroom manufacturing.

Culture & Benefits

• Competitive salary and benefits package.
• Opportunity to work on advanced semiconductor packaging technology.
• Collaborative, cross-functional engineering environment.
• Career growth within the manufacturing and process engineering track.