Wire Bond Process & Equipment Senior/Staff Engineer (Semiconductor)

Location: Seremban, Malaysia

Company

hirify.global is a semiconductor manufacturing company focused on reliable, high-volume production and continuous process improvement.

What you will do

• Lead the setup, qualification, and optimization of wire bonding equipment and processes, including CZ and DOE activities.
• Improve yield, reliability, throughput, and manufacturing value add through data-driven process optimization and cost-reduction projects.
• Troubleshoot equipment and process issues and manage non-conforming material disposition and corrective/preventive actions.
• Collaborate with R&D, design, quality, process engineering, and manufacturing teams on new product introductions.
• Develop and maintain FMEA, Control Plans, OCAP, SPC documentation, and audit support materials.
• Mentor junior engineers and promote knowledge sharing, safety, quality, and environmental compliance.

Requirements

• Bachelor’s degree in electrical/electronic engineering, mechanical engineering, materials science, or a related field.
• 5–8 years of experience in wire bonding equipment and semiconductor process engineering.
• Strong knowledge of thermosonic and ultrasonic wire bonding for gold and copper wire.
• Hands-on experience with ASM wire bonders, bonder programming, and process optimization.
• Experience with JMP, Minitab, or other statistical tools, supported by strong analytical and problem-solving skills.
• Knowledge of semiconductor manufacturing standards, quality control, and reliability testing, with strong cross-functional communication skills.

Nice to have

• Hands-on experience with KNS wire bonders.
• Experience handling additional wire types.

Culture & Benefits

• Inclusive and accessible recruitment process with fair consideration for applicants.
• Safe work environment and reasonable adjustments where requested.
• Opportunity to join employee resource groups, including the Pride Network Group and global and local women’s groups.
• Commitment to increasing women in management positions to 30% by 2030.