Senior Packaging Development Engineer

Location: Penang, Malaysia

Company

hirify.global develops integrated power semiconductors and power delivery systems for industrial, automotive, renewable energy, and telecommunications markets.

What you will do

• Design, develop, and scale new semiconductor packages and power modules to volume production.
• Translate system requirements into package and module definitions meeting electrical, thermal, and mechanical specifications.
• Use simulation software to evaluate semiconductor packaging and board-level applications.
• Collaborate with internal cross-functional teams, subcontractors, and material suppliers on packaging technologies and assembly processes.
• Optimize assembly materials and processes for package performance, reliability, manufacturing yield, and cost.
• Benchmark competing package designs and develop new methodologies, technologies, and intellectual property while supporting multiple product lines and customers.

Requirements

• Bachelor’s or master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field.
• At least 3 years of experience designing packages and modules.
• Proficiency with CAD software; AutoCAD and SolidWorks are preferred.
• Deep understanding of packaging technologies, process flows, materials, qualification, and manufacturing implementation.
• Knowledge of thermal, electrical, and mechanical FEA/CFD simulation methods and software for semiconductor packaging and board-level applications.
• Excellent communication, writing, presentation, innovation, and problem-solving skills.

Nice to have

• Experience with ANSYS Icepak, Q3D, or Mechanical.
• System-level simulation skills.

Culture & Benefits

• Attractive compensation.
• Supportive and diverse work environment.
• Opportunities for personal and professional development.
• Focus on creativity, sustainability, innovation, and equal opportunity.