Staff Packaging Engineer (Semiconductor)

Location: Penang, Malaysia; onsite at a subcontractor factory and site

Company

hirify.global develops semiconductor power management solutions.

What you will do

• Drive improvements in assembly yield, quality, delivery, and cost for mass-production products.
• Manage new product introduction at the subcontractor factory.
• Support new product, process, and package development.
• Investigate and resolve customer complaint cases.
• Perform regular process and quality audits at the subcontractor site.
• Collaborate closely with cross-functional teams on assembly engineering projects.

Requirements

• Bachelor’s degree or higher in engineering.
• At least 8 years of experience in semiconductor assembly process engineering, NPI engineering, or assembly subcontractor management.
• Good understanding of assembly process control and requirements.
• Strong project management and problem-solving skills.
• Fluent English.
• Technical competence, self-motivation, strong commitment, and assertiveness.

Nice to have

• Hands-on experience with wire bonding and/or molding processes.

Culture & Benefits

• Work with cross-functional teams on assembly engineering projects.
• Work onsite at a subcontractor factory in Penang, Malaysia.