Staff Packaging Engineer (Semiconductor Assembly)

Location: Penang, Malaysia

Company

hirify.global develops semiconductor power solutions and manages manufacturing through subcontractor facilities.

What you will do

• Drive improvements in assembly yield, product quality, delivery performance, and cost for mass-production products.
• Manage new product introduction activities at the subcontractor factory.
• Support new product, process, and package development.
• Investigate customer complaints and drive corrective solutions.
• Conduct regular process and quality audits at the subcontractor site.
• Collaborate with cross-functional teams on assembly engineering projects.

Requirements

• Bachelor’s degree or higher in engineering.
• At least 8 years of experience in semiconductor assembly processes, NPI engineering, or assembly subcontractor management.
• Good understanding of assembly process controls and requirements.
• Strong project management and problem-solving skills.
• Fluent English required.
• Technical competence, self-motivation, commitment, and assertiveness.

Nice to have

• Hands-on experience with wire bonding and/or molding processes.

Culture & Benefits

• Cross-functional collaboration on assembly engineering projects.
• Regular engagement with subcontractor manufacturing and quality teams.
• Opportunity to influence production improvement and new product introduction.