Package Architect (Semiconductor Packaging)

Location: Penang, Malaysia

Company

hirify.global develops silicon package solutions and semiconductor packaging technologies.

What you will do

• Translate product requirements into package architecture specifications.
• Drive end-to-end package solutions covering physical, electrical, mechanical, thermal, reliability, and cost requirements.
• Lead technology trade-off decisions and collaborate with silicon, hardware, and package leads.
• Oversee package design, development processes, procedures, and quality standards.
• Troubleshoot packaging issues involving designs, materials, and processes, providing cost-effective solutions.
• Coordinate with manufacturing to transition package designs and tape-out into production.

Requirements

• 15+ years of professional experience in packaging or board design development.
• BS or MS degree in EE, ME, CE, CS, or a related field.
• Experience with package design tools and leading substrate or package design and development projects.
• Ability to work at the primary location in Penang, Malaysia.

Nice to have

• Experience developing automated design flows and tracking design efficiency metrics.
• Experience with semiconductor packaging substrate technology design and development.
• Experience with Mentor Graphics, Cadence, or AutoCAD package design tools.

Culture & Benefits

• Regular full-time employment.
• Day shift based in Malaysia.
• Focus on packaging quality, continuous improvement, and production readiness.