Engineer, Packaging Engineering (Mechanical Design)

Location: Batu Kawan, Malaysia — onsite at the Penang SDSM Office

Company

hirify.global develops and manufactures Flash memory and advanced memory technology products for global markets.

What you will do

• Develop thermal designs across semiconductor packaging, flash product PCBA, and host levels.
• Perform thermal modeling using CFD, analytical and numerical analysis, and measurement techniques.
• Design solutions for small-form-factor packages with constrained physical and thermal environments.
• Apply mechanical design, drafting, and tolerance analysis principles to product development.
• Work with outside suppliers and contract manufacturers to release products on schedule.

Requirements

• Bachelor’s degree in Mechanical Engineering and 5 years of relevant industry experience.
• Strong knowledge of mechanical design and proficiency with CAD software such as SolidWorks or AutoCAD.
• Knowledge of engineering drafting standards and tolerance analysis.
• Knowledge of plastic injection molding and metal fabrication.
• Strong oral and written communication skills and the ability to work effectively in a team environment.

Nice to have

• Experience designing electronic consumer products.
• Prior retail packaging design experience.

Culture & Benefits

• Inclusive environment focused on diversity, belonging, respect, and contribution.
• Opportunities to work within a global manufacturing and technology organization.
• Accessibility support is available throughout the application and hiring process.