Senior Packaging Engineer, Material Engineering (Semiconductor Packaging)

Location: Onsite at the Penang SDSM Office in Batu Kawan, Pulau Pinang, Malaysia

Company

hirify.global develops flash memory and advanced data-storage technologies supported by global manufacturing capabilities.

What you will do

• Advance packaging materials for smaller form factors, thinner dies, higher interconnect density, increased power, and improved reliability.
• Lead the evaluation, development, and qualification of materials for product development and high-volume manufacturing.
• Perform material characterization, laboratory testing, and design of experiments to simulate manufacturing processes and use-condition failures.
• Analyze thermal, mechanical, and environmental material performance against reliability and performance targets.
• Collaborate with package and product design, reliability, failure analysis, assembly R&D, process teams, and suppliers to integrate material solutions into production.

Requirements

• Master’s or PhD in Materials Science or a related engineering field.
• At least 5 years of experience in semiconductor packaging, materials engineering, or a related industry.
• Strong knowledge of material characterization or material mechanics, including failure analysis and design of experiments.
• Understanding of packaging material systems such as polymers, adhesives, laminates, EMC, and substrates.
• Familiarity with ASTM and JEDEC standards and reliability test methods.
• Experience working in cross-functional engineering environments with strong analytical and communication skills.

Nice to have

• Experience with material testing and characterization instruments.
• Understanding of semiconductor packaging processes such as molding, wire bonding, die attach, flip chip, and SMT.
• Supplier engagement experience and sustainability-driven material development.

Culture & Benefits

• Full-time exempt employment.
• Work within a global, cross-functional engineering environment.
• Inclusive workplace focused on diversity, belonging, respect, and contribution.
• Accommodation support is available throughout the application and hiring process.