Senior Power Packaging Engineer (Semiconductors)

Location: Shanghai, China

Company

hirify.global develops integrated power semiconductors and power delivery systems for customers worldwide.

What you will do

• Establish and enforce DFM guidelines for PCB fabrication and PCBA assembly, including trace and spacing rules, via design, impedance control, component placement, solder mask, and stencil design.
• Lead packaging, structural design, and process development for 800VDC/400VDC to 48V/12V/6V Power Shelf and PDB products.
• Drive development of CoB, SiP, and other complex module packages from concept through mass production.
• Develop and qualify SMT, die attach, wire bonding or flip-chip, underfill, molding, coating, soldering, potting, insulation, and heatsink assembly processes.
• Identify and resolve manufacturing, testability, thermal, insulation, creepage, and reliability risks through prototyping, testing, and process verification.
• Track packaging technologies and materials to improve product performance and cost efficiency.

Requirements

• Bachelor’s degree or above in Power Electronics, Mechanical Engineering, Materials Science, Microelectronics Packaging, or a related field.
• At least 5 years of hands-on experience in module-level development, PCB/PCBA DFM, and process engineering.
• Expert knowledge of PCB/PCBA design, materials, fabrication, and assembly processes; IPC standards knowledge is required.
• Deep understanding of SMT, flip-chip, wire-bonding, underfill, and molding processes for advanced packages.
• Proficiency with SolidWorks and AutoCAD, plus familiarity with SiC/GaN packaging, potting materials, connectors, and high-power-density assembly.
• Ability to independently resolve soldering, mechanical assembly, process, and reliability failure-analysis issues.

Culture & Benefits

• Full-time employment in the semiconductor industry.
• Focus on creativity, sustainability, leading-edge products, and technical innovation.
• Equal opportunity employment and a commitment to diversity.