Flip Chip Process Engineer (Silicon Photonics)

Location: Singapore

Company

hirify.global develops and manufactures silicon photonic chip wafer solutions.

What you will do

• Develop and provide technical support for flip-chip assembly processes, including plasma cleaning, flux engineering, pick-and-place, reflow, underfill, curing, and TCB/NCP flux-less flows.
• Design and execute DOE studies to characterize process windows, margins, thermal stress, and mechanical stress.
• Optimize process integration with upstream bump and FO processes to improve yield and manufacturability.
• Evaluate and qualify manufacturing materials such as NCP, flux, and underfill.
• Lead reliability validation using TCT, HAST, and HTS methodologies.
• Investigate flip-chip failure modes, establish root causes, and implement process improvements.

Requirements

• Bachelor’s or Master’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, Microelectronics, or an equivalent technical discipline.
• 5+ years of hands-on industry experience in flip-chip assembly.
• Strong practical knowledge of flip-chip cleaning, flux, placement, reflow, underfill, curing, and/or TCB/NCP flux-less processes.
• Understanding of finite element simulation for warpage, thermal dissipation, and structural mechanical integrity.
• Experience with FMEA, SPC controls, and structured 8D problem-solving.
• High proficiency with JMP and Minitab.

Culture & Benefits

• Full-time role in the Operations department.
• Work includes collaboration with OSAT or internal manufacturing lines.
• Responsibilities cover process SOPs, work instructions, failure reports, engineering changes, NPI, and process verification.