Назад
Company hidden
1 день назад

APTD SWA Module Engineer On-Shift (Day Shift) (Semiconductor Manufacturing)

99 030 - 162 500$
Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
Для мэтча и отклика нужен Plus

Мэтч & Сопровод

Для мэтча с этой вакансией нужен Plus

Описание вакансии

Текст:
/
TL;DR
APTD SWA Module Engineer On-Shift (Day Shift) (Semiconductor Manufacturing): Providing real-time factory support for advanced packaging substrate and wafer assembly manufacturing with an accent on equipment troubleshooting, process recovery, lot disposition, and tool enablement. Focus on solving complex production issues, qualifying new tools, analyzing development data, and maintaining continuous lot movement through the manufacturing line.

Location: On-site in Phoenix, Arizona, United States; day shift supporting continuous 24/7 manufacturing operations.

Annual salary: $99,030–$162,500 USD

Company

hirify.global develops semiconductor technologies and advanced packaging solutions, including substrate and wafer assembly technologies.

What you will do

  • Provide real-time factory-floor support for equipment, process, and product issues.
  • Troubleshoot process problems, execute error recovery, and support lot disposition decisions to maintain production flow.
  • Create and update specifications and Requests for Change as required.
  • Perform non-standard procedures, panel inspections, and imaging activities to collect development data.
  • Communicate critical issues and shift priorities with tool owners, lot owners, management, factory personnel, and other stakeholders.
  • Support new tool qualification and enablement activities, including thorough shift handoffs.

Requirements

  • Bachelor’s degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related technical discipline, plus 2+ years of experience in lithography, exposure mask, wet etch, and dry etch processes.
  • Alternatively, a master’s degree in a related technical discipline plus 1+ year of relevant process experience.
  • Strong problem-solving, analytical, troubleshooting, communication, and organizational skills.
  • Ability to work independently, adapt to changing priorities, and collaborate across engineering and manufacturing teams.
  • Immigration sponsorship is not available.
  • On-site work in Phoenix, Arizona is required.

Nice to have

  • Experience with statistical data analysis, process characterization, manufacturing quality systems, DOE, and SPC.
  • Knowledge of manufacturing process control, reliability testing, and continuous process improvement.
  • Experience in semiconductor manufacturing, advanced packaging, or packaging substrate development.
  • Familiarity with metrology tool recipe development, optimization, and troubleshooting.

Culture & Benefits

  • Collaborative environment focused on innovative, cost-effective packaging technologies.
  • Competitive compensation with stock bonuses.
  • Health, retirement, and vacation benefits.
  • Employment with a full-time experienced-hire structure.

Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →