Senior Packaging Engineer

Location: Chengdu, China

Company

hirify.global develops integrated power semiconductors and power delivery architectures, with a focus on leading-edge products, innovation, and sustainability.

What you will do

• Develop total package solutions, including package design, process development, qualification, and engineering troubleshooting.
• Recommend package types and support frame or substrate design and material selection for flip-chip, wire-bonding, aluminum-wire, and clip applications.
• Handle assembly process and failure-analysis quality issues, identify root causes, and implement solutions.
• Develop and monitor new packages, processes, and materials through mass production.
• Lead process activities and identify technical risks during new product development.

Requirements

• Bachelor’s degree and more than five years of relevant work experience.
• Experience with assembly processes or new product introduction for lead frames or substrates.
• Knowledge of complete assembly processes for wire bonding, flip chip, aluminum wire, and clip technologies.
• Knowledge of assembly materials such as epoxy, solder, and EMC compounds.
• Strong engineering troubleshooting skills for identifying assembly defects.
• Good English reading and writing skills.

Nice to have

• Frame or substrate design experience.
• Knowledge of thermal and stress characterization.
• CAD or SolidWorks skills.

Culture & Benefits

• Work in a fast-growing semiconductor company.
• Contribute to power semiconductor products and power delivery architectures.
• Join an environment that values creativity, sustainability, diversity, and innovation.