15 часов назад
Sr. Director of Silicon Hardware Engineering (Boards, Packages, and Reliability)
231 500 - 335 000$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Sr. Director of Silicon Hardware Engineering (Boards, Packages, and Reliability) (Semiconductor Hardware): Leading global engineering functions for chip packages, board hardware, and silicon power and reliability with an accent on advanced 2.5D/3D packaging, signal integrity, power integrity, and reliability qualification. Focus on executing multi-program hardware strategies, improving tapeout and first-pass silicon success, and managing vendors and distributed teams across US and Asia.
Location: San Jose, California, United States
Salary: $231,500–$335,000 USD annually for the Bay Area California market
Company
is an independent FPGA solutions provider developing programmable technologies for AI, cloud, networking, and edge markets.
What you will do
- Lead chip package development, board development, and silicon power and reliability engineering functions.
- Build and develop distributed engineering teams across US and Asia sites.
- Define technical strategies for 2.5D/3D IC, flip-chip, high-density interconnect, and advanced packaging.
- Oversee board hardware development from concept through bring-up, including design-for-manufacturability and design-for-test.
- Drive signal integrity, power integrity, power budgeting, electromigration, ESD, and reliability qualification programs.
- Own multi-program execution, cost reduction, supplier qualification, and vendor relationships with OSATs, PCB fabricators, substrate suppliers, and EDA vendors.
Requirements
- Bachelor’s degree in Electrical Engineering, Computer Engineering, or a closely related field; a master’s degree is preferred.
- 15+ years of progressive semiconductor hardware engineering experience, including at least 5 years in senior leadership or director-level roles.
- Experience managing global cross-functional engineering teams across US and Asian sites.
- Deep expertise in chip package development, advanced packaging, substrate design, and OSAT management.
- Experience with board schematics, layout, bring-up, signal integrity, and power integrity analysis tools such as Ansys SIwave, Cadence Sigrity, or HyperLynx.
- Knowledge of silicon design methodologies including synthesis, place and route, timing closure, and design-for-test, plus strong executive communication skills.
Culture & Benefits
- Work within a global, distributed engineering organization.
- Collaborate with silicon architecture, SoC design, system integration, product management, customers, and technology partners.
- Receive incentive opportunities based on individual and company performance.
- Participate in a results-driven culture focused on technical excellence, operational improvement, and supply chain resilience.
- Applicants must be eligible for any required U.S. export authorizations.
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