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23 часа назад

Manufacturing Operations Technical Programme Manager (Silicon and Packaging)

Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
UK
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Manufacturing Operations Technical Programme Manager (Silicon and Packaging) (Semiconductor Manufacturing): Managing wafer production, packaging, assembly, testing, qualification, and shipment through foundry, OSAT, and contract manufacturing partners with an accent on technical milestones, complex schedules, supplier risks, and cross-functional execution. Focus on coordinating silicon delivery, supporting NPI and production ramp, and building scalable programme management practices across hardware and manufacturing workstreams.

Location: Bristol, United Kingdom

Company

hirify.global is a semiconductor and AI hardware startup founded in 2022, building chips and systems for high-speed inference of frontier AI models.

What you will do

  • Own the end-to-end programme plan from wafer production through packaged silicon delivery.
  • Coordinate foundry, OSAT, packaging, logistics, and contract manufacturing partners.
  • Track wafer starts, fabrication, packaging, assembly, final testing, qualification, and shipment milestones.
  • Manage risks, dependencies, schedule changes, technical handoffs, and issue resolution across internal and external stakeholders.
  • Ensure manufacturing documentation, test requirements, quality requirements, and build-readiness materials are complete.
  • Support NPI, prototype builds, qualification, production ramp, and programme reviews that surface risks early.

Requirements

  • 5+ years of experience in technical project management, operations, supply chain, or programme management within semiconductors or complex hardware.
  • Experience working with foundries, OSATs, packaging suppliers, or contract manufacturers.
  • Strong understanding of semiconductor production and packaging flows.
  • Ability to manage complex schedules, multiple stakeholders, technical dependencies, supplier risks, and cross-functional execution.
  • Experience with Jira, Confluence, Linear, Asana, Smartsheet, MS Project, or PLM systems.
  • Highly organised, structured, and able to communicate clearly with engineers and executives.

Nice to have

  • Experience with advanced packaging, high-performance computing, chiplets, 2.5D/3D integration, or HBM-based packages.
  • Familiarity with silicon bring-up, NPI, qualification, yield tracking, and production ramp.
  • Experience working with Asian semiconductor supply chains and partners.
  • Experience building processes in a rapidly scaling organisation.

Culture & Benefits

  • Meaningful equity and ownership participation.
  • Private medical, dental, and vision insurance.
  • Contributory pension.
  • 25 days of holiday plus bank holidays.
  • Life and critical illness insurance.
  • Inclusive and diverse office environment with a focus on equal employment opportunity.

Hiring process

  • Additional eligibility checks may be required because the work is subject to UK, US, and other international export control regulations.

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