23 часа назад
Manufacturing Operations Technical Programme Manager (Silicon and Packaging)
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Manufacturing Operations Technical Programme Manager (Silicon and Packaging) (Semiconductor Manufacturing): Managing wafer production, packaging, assembly, testing, qualification, and shipment through foundry, OSAT, and contract manufacturing partners with an accent on technical milestones, complex schedules, supplier risks, and cross-functional execution. Focus on coordinating silicon delivery, supporting NPI and production ramp, and building scalable programme management practices across hardware and manufacturing workstreams.
Location: Bristol, United Kingdom
Company
is a semiconductor and AI hardware startup founded in 2022, building chips and systems for high-speed inference of frontier AI models.
What you will do
- Own the end-to-end programme plan from wafer production through packaged silicon delivery.
- Coordinate foundry, OSAT, packaging, logistics, and contract manufacturing partners.
- Track wafer starts, fabrication, packaging, assembly, final testing, qualification, and shipment milestones.
- Manage risks, dependencies, schedule changes, technical handoffs, and issue resolution across internal and external stakeholders.
- Ensure manufacturing documentation, test requirements, quality requirements, and build-readiness materials are complete.
- Support NPI, prototype builds, qualification, production ramp, and programme reviews that surface risks early.
Requirements
- 5+ years of experience in technical project management, operations, supply chain, or programme management within semiconductors or complex hardware.
- Experience working with foundries, OSATs, packaging suppliers, or contract manufacturers.
- Strong understanding of semiconductor production and packaging flows.
- Ability to manage complex schedules, multiple stakeholders, technical dependencies, supplier risks, and cross-functional execution.
- Experience with Jira, Confluence, Linear, Asana, Smartsheet, MS Project, or PLM systems.
- Highly organised, structured, and able to communicate clearly with engineers and executives.
Nice to have
- Experience with advanced packaging, high-performance computing, chiplets, 2.5D/3D integration, or HBM-based packages.
- Familiarity with silicon bring-up, NPI, qualification, yield tracking, and production ramp.
- Experience working with Asian semiconductor supply chains and partners.
- Experience building processes in a rapidly scaling organisation.
Culture & Benefits
- Meaningful equity and ownership participation.
- Private medical, dental, and vision insurance.
- Contributory pension.
- 25 days of holiday plus bank holidays.
- Life and critical illness insurance.
- Inclusive and diverse office environment with a focus on equal employment opportunity.
Hiring process
- Additional eligibility checks may be required because the work is subject to UK, US, and other international export control regulations.
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