Senior Program Managers (Advanced Packaging)

Location: Tokyo, Japan; onsite presence required at least three days per week with regular travel to supplier sites and factories.

Company

hirify.global Foundry develops advanced semiconductor process, packaging, manufacturing, supply chain, and assembly/test solutions for customers, including technologies for the AI era.

What you will do

• Develop and deliver advanced substrate packaging and wafer assembly solutions, including the EMIB-T technology.
• Collaborate with supplier engineering teams and US integration teams on substrate building blocks and critical process interactions.
• Monitor bottleneck capacity, optimize throughput time, and analyze substrate lead times to deliver reduction roadmaps.
• Manage product and test vehicle delivery schedules, resolve issues, and support on-time delivery targets.
• Design and execute factory test vehicle and product certification plans focused on yield improvement.
• Lead new factory capacity qualification, startup milestone tracking, and production ramp-up while influencing senior supplier management.

Requirements

• Bachelor’s or master’s degree with 8+ years of experience, or PhD with 4+ years of experience, in science or engineering.
• 6+ years of experience in fab back-end or substrate manufacturing process development.
• Experience with capacity management, lead time analysis, yield improvement, structured problem solving, supplier influence, and stakeholder management.
• Understanding of substrate processes including component embedding, laser drilling, dielectric lamination, lithography, electrolytic plating, defect inspection, metrology, and electrical testing.
• Fluent business-level English communication, strong presentation skills, and the ability to engage with supplier executive management.
• Regular onsite presence at factories is required, with a minimum of three days per week and travel to supplier sites.

Nice to have

• Experience qualifying or owning process tools in technology development, ramp, or high-volume manufacturing contexts.
• Hands-on experience in factory operations, substrates, manufacturing, process engineering, and yield improvement.

Culture & Benefits

• Collaboration with diverse teams across Asia and the US.
• Work at the forefront of packaging technologies for next-generation AI devices.
• Regular interaction with worldwide substrate suppliers and manufacturing partners.
• Flexibility to adapt to changing project scopes and business needs.