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Senior Program Manager (Semiconductors)

Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
c1
Страна
Japan
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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Описание вакансии

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TL;DR
Senior Program Manager (Semiconductors): Leading advanced substrate packaging and wafer assembly programs for next-generation AI devices with an accent on supplier collaboration, capacity scaling, and process integration. Focus on driving EMIB-T technology deployment, optimizing manufacturing throughput, and managing complex factory startup schedules.

Location: Must be based in Tokyo, Japan (On-site role)

Company

hirify.global Foundry is a global leader in semiconductor manufacturing, delivering cutting-edge silicon process and packaging technology for the AI era.

What you will do

  • Collaborate with on-site supplier engineering teams and US integration teams to advance substrate technologies.
  • Monitor and optimize bottleneck processes to reduce throughput time and improve capacity.
  • Oversee product and test vehicle delivery schedules to meet aggressive on-time delivery targets.
  • Develop and execute roadmaps for lead time reduction and factory startup milestones.
  • Lead qualification activities and monitor production ramp-up indicators for new capacity.
  • Influence strategic decision-making at senior supplier management levels.

Requirements

  • Bachelor's or Master's degree with 8+ years, or PhD with 4+ years of experience in Science or Engineering.
  • 6+ years of experience in fab back-end or substrate manufacturing process development.
  • Fluent business-level English communication skills required.
  • Must be able to work on-site in Tokyo, Japan, with regular travel to supplier sites.
  • Strong technical expertise in solving complex manufacturing challenges.

Nice to have

  • Experience in capacity management, lead time analysis, and yield improvement.
  • Understanding of substrate process building blocks like lithography, plating, and electrical testing.
  • Hands-on experience in factory operations and process engineering.
  • Experience qualifying process tools in a TD/ramp or HVM context.

Culture & Benefits

  • Opportunity to work at the forefront of AI-enabling packaging technologies.
  • Collaboration with diverse, global teams across Asia and the US.
  • Commitment to ethical hiring practices and Responsible Business Alliance (RBA) compliance.
  • Dynamic work environment with evolving project scopes and strategic impact.

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