Staff RF Engineer

Location: Shenzhen, Nanshan, China

Company

hirify.global develops high-performance optical and photonic technologies.

What you will do

• Design RF channels for 800G/1.6T and higher-bandwidth module-level MB and EVB test boards.
• Define PCB materials, stack-ups, RF trace widths, spacing, and connector selections for module- and component-level boards.
• Perform 3D electromagnetic modeling, passive-channel simulation, full-channel simulation, RF optimization, and post-simulation validation.
• Conduct RF testing of EVB, MB, and FPC designs using TDR, PNA, probes, and related laboratory instruments.
• Investigate RF issues throughout product testing, including root-cause analysis and RMA support.
• Collaborate with PCB, FPC, package, connector, chip, mechanical, assembly, and layout teams across different sites.

Requirements

• Bachelor’s or master’s degree in electronic information engineering, communications engineering, microwave technology, or a related field.
• At least 5 years of experience with high-speed optoelectronic products; experience with 800G/1.6T module MB simulation and optimization is preferred.
• Experience with at least one 3D EM solver, such as HFSS, CST, or EMPro, and the ability to independently complete modeling and RF optimization.
• Experience with channel simulation tools such as ADS or Circuit, including connecting simulation models and analyzing parameter configurations.
• Knowledge of PCB Dk/Df parameters, manufacturing processes, impedance calculations, PCB stack-up design, and RF trace specifications.
• Fluent English in listening, speaking, reading, and writing is required.

Nice to have

• Experience with RF problem analysis and fault localization.
• Experience with 800G/1.6T module main-board simulation and optimization.

Culture & Benefits

• Full-time employment.
• Cross-functional collaboration across multiple sites and technology partners.
• Equal-opportunity workplace with reasonable accommodations available during recruitment and employment.