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12 часов назад

Technologist, Packaging Engineering

Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Malaysia
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Technologist, Packaging Engineering (Semiconductor Packaging): Driving the design, qualification, release, and high-volume manufacturing transition of semiconductor package solutions with an accent on packaging materials, reliability, assembly processes, and cross-functional technical leadership. Focus on improving assembly yields, reducing package costs, developing technology roadmaps, and applying DFM, DFA, DFRW, machine learning, and data analytics to packaging decisions.

Location: Batu Kawan, Malaysia; Penang SDSM Office

Company

hirify.global develops and manufactures Flash memory and advanced memory technology products through global manufacturing and supply-chain operations.

What you will do

  • Set technical direction for package engineering and ensure packages are characterized, qualified, and released to production on schedule.
  • Own the package lifecycle across design, development, qualification, manufacturing, and high-volume production.
  • Coordinate with global factories, contract manufacturers, packaging R&D teams, and cross-functional engineering stakeholders.
  • Lead new package designs and advanced assembly processes into scalable, cost-effective high-volume manufacturing.
  • Drive assembly yield improvement, package cost reduction, technology roadmaps, budgets, and packaging infrastructure development.
  • Evaluate design options through characterization builds and DFX analyses, including DFM, DFA, and DFRW.

Requirements

  • Master’s degree or PhD in Material Science, Manufacturing, Mechanical Engineering, Computer Science, Physics, or another engineering discipline.
  • At least 10 years of relevant experience with a Master’s degree, or 8+ years with a PhD.
  • Proficiency in SMT, PCBA, solder joint reliability, board-level reliability, packaging materials, failure analysis, and PCB layout.
  • Knowledge of thermo-mechanical aspects of semiconductor packages and Solid-State Drives.
  • Strong problem-solving, experimental design, statistical analysis, and communication skills.
  • Experience with machine learning and data analytics using AI technologies.

Nice to have

  • Experience with flash back-end processes for active component manufacturing.
  • Experience mentoring or managing junior engineers.
  • Knowledge of industry benchmarking and packaging technology roadmap development.

Culture & Benefits

  • Full-time employment in an exempt position.
  • Work with global cross-functional teams and manufacturing organizations.
  • Inclusive environment focused on diversity, belonging, respect, and contribution.
  • Accessibility support is available throughout the application and hiring process.

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