12 часов назад
Technologist, Packaging Engineering
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Technologist, Packaging Engineering (Semiconductor Packaging): Driving the design, qualification, release, and high-volume manufacturing transition of semiconductor package solutions with an accent on packaging materials, reliability, assembly processes, and cross-functional technical leadership. Focus on improving assembly yields, reducing package costs, developing technology roadmaps, and applying DFM, DFA, DFRW, machine learning, and data analytics to packaging decisions.
Location: Batu Kawan, Malaysia; Penang SDSM Office
Company
develops and manufactures Flash memory and advanced memory technology products through global manufacturing and supply-chain operations.
What you will do
- Set technical direction for package engineering and ensure packages are characterized, qualified, and released to production on schedule.
- Own the package lifecycle across design, development, qualification, manufacturing, and high-volume production.
- Coordinate with global factories, contract manufacturers, packaging R&D teams, and cross-functional engineering stakeholders.
- Lead new package designs and advanced assembly processes into scalable, cost-effective high-volume manufacturing.
- Drive assembly yield improvement, package cost reduction, technology roadmaps, budgets, and packaging infrastructure development.
- Evaluate design options through characterization builds and DFX analyses, including DFM, DFA, and DFRW.
Requirements
- Master’s degree or PhD in Material Science, Manufacturing, Mechanical Engineering, Computer Science, Physics, or another engineering discipline.
- At least 10 years of relevant experience with a Master’s degree, or 8+ years with a PhD.
- Proficiency in SMT, PCBA, solder joint reliability, board-level reliability, packaging materials, failure analysis, and PCB layout.
- Knowledge of thermo-mechanical aspects of semiconductor packages and Solid-State Drives.
- Strong problem-solving, experimental design, statistical analysis, and communication skills.
- Experience with machine learning and data analytics using AI technologies.
Nice to have
- Experience with flash back-end processes for active component manufacturing.
- Experience mentoring or managing junior engineers.
- Knowledge of industry benchmarking and packaging technology roadmap development.
Culture & Benefits
- Full-time employment in an exempt position.
- Work with global cross-functional teams and manufacturing organizations.
- Inclusive environment focused on diversity, belonging, respect, and contribution.
- Accessibility support is available throughout the application and hiring process.
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